參數(shù)資料
型號: ADSP-BF504KCPZ-4
廠商: Analog Devices Inc
文件頁數(shù): 48/80頁
文件大小: 0K
描述: IC CCD SIGNAL PROCESSOR 88LFCSP
視頻文件: Blackfin? BF50x Processor Family
標準包裝: 1
系列: Blackfin®
類型: 定點
接口: CAN,EBI/EMI,I²C,IrDA,PPI,SPI,SPORT,UART/USART
時鐘速率: 400MHz
非易失內(nèi)存: 外部
芯片上RAM: 68kB
電壓 - 輸入/輸出: 1.8V,2.5V,3.3V
電壓 - 核心: 1.31V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 88-VFQFN 裸露焊盤,CSP
供應商設備封裝: 88-LFCSP(12x12)
包裝: 托盤
Rev. A
|
Page 52 of 80
|
July 2011
ADSP-BF504/ADSP-BF504F/ADSP-BF506F
PROCESSOR—ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where: TJ = junction temperature (°C).
TCASE = case temperature (°C) measured by customer at top cen-
ter of package.
Ψ
JT = from Table 43 and Table 44.
PD = power dissipation (see Total Power Dissipation on Page 29
for the method to calculate PD).
Values of
θ
JA are provided for package comparison and printed
circuit board design considerations.
θ
JA can be used for a first
order approximation of TJ by the equation:
where TA = ambient temperature (°C)
Values of
θ
JC are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required.
Values of
θ
JB are provided for package comparison and printed
circuit board design considerations.
In Table 43 and Table 44, airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6, and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883 (Method
1012.1). All measurements use a 2S2P JEDEC test board.
Figure 47. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (1.8 V VDDEXT)
Figure 48. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (2.5 V VDDEXT)
Figure 49. Driver Type C Typical Rise and Fall Times (10%–90%) vs.
Load Capacitance (3.3 V VDDEXT)
15
RISE
AND
F
ALL
TIME
(ns)
LOAD CAPACITANCE (pF)
0
50
100
150
250
25
20
0
5
10
200
t
RISE
t
FALL
t
RISE = 1.8V @ 25°C
t
FALL = 1.8V @ 25°C
8
RISE
AND
F
ALL
TIME
(ns)
LOAD CAPACITANCE (pF)
0
50
100
150
250
16
12
0
2
4
10
200
t
RISE
t
FALL
6
14
t
RISE = 2.5V @ 25°C
t
FALL = 2.5V @ 25°C
6
RISE
AND
F
ALL
TIME
(ns)
LOAD CAPACITANCE (pF)
0
50
100
150
250
14
12
0
2
4
8
200
t
RISE
t
FALL
t
RISE = 3.3V @ 25°C
t
FALL = 3.3V @ 25°C
10
Table 43. Thermal Characteristics (88-Lead LFCSP)
Parameter
Condition
Typical
Unit
θ
JA
0 linear m/s air flow
26.2
°C/W
θ
JMA
1 linear m/s air flow
23.7
°C/W
θ
JMA
2 linear m/s air flow
22.9
°C/W
θ
JB
16.0
°C/W
θ
JC
9.8
°C/W
Ψ
JT
0 linear m/s air flow
0.21
°C/W
Ψ
JT
1 linear m/s air flow
0.36
°C/W
Ψ
JT
2 linear m/s air flow
0.43
°C/W
Table 44. Thermal Characteristics (120-Lead LQFP)
Parameter
Condition
Typical
Unit
θ
JA
0 linear m/s air flow
26.9
°C/W
θ
JMA
1 linear m/s air flow
24.2
°C/W
θ
JMA
2 linear m/s air flow
23.3
°C/W
θ
JB
16.4
°C/W
θ
JC
12.7
°C/W
Ψ
JT
0 linear m/s air flow
0.50
°C/W
Ψ
JT
1 linear m/s air flow
0.77
°C/W
Ψ
JT
2 linear m/s air flow
1.02
°C/W
TJ
TCASE
Ψ
JT
PD
×
()
+
=
TJ
TA
θ
JA
PD
×
()
+
=
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