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參數(shù)資料
| 型號： | ADSP-BF512BBCZ-4F4 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 56/68頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 16/32B 400MHZ 168CSPBGA |
| 標準包裝： | 1 |
| 系列： | Blackfin® |
| 類型： | 定點 |
| 接口： | I²C，PPI，SPI，SPORT，UART/USART |
| 時鐘速率： | 400MHz |
| 非易失內存： | 閃存（4Mb） |
| 芯片上RAM： | 116kB |
| 電壓 - 輸入/輸出： | 1.8V，2.5V，3.3V |
| 電壓 - 核心： | 1.30V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 168-LFBGA，CSPBGA |
| 供應商設備封裝： | 168-CSPBGA（12x12） |
| 包裝： | 托盤 |
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Rev. B
|
Page 6 of 68
|
January 2011
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
The processors internally connect to the flash memory die with
the SPI0SCK, SPI0SEL4 or PH8, SPI0MOSI, and SPI0MISO sig-
nals similar to an external SPI flash. To further provide a secure
processing environment, these internally connected signals are
not exposed outside of the package. For this reason, program-
ming the ADSP-BF51xF flash memory is performed by running
code on the processor andcannot be programmed from external
signals. Data transfers between the SPI flash and the processor
cannot be probed externally. The flash memory has the follow-
ing additional features
Serial Interface Architecture—SPI compatible with Mode 0
and Mode 3
Superior Reliability—Endurance of 100,000 cycles and
greater than 100 years data retention
Flexible Erase Capability—Uniform 4K Byte sectors and
uniform 32 and 64K Byte overlay blocks
Fast Erase and Byte-Program—Chip-erase time = 125 ms
(typical), Sector-/Block-Erase Time = 62 ms (typical) Byte-
Program Time = 50 μS (typical)
Auto Address Increment (AAI) Programming—Decreases
total chip programming time over byte-program
operations
End-of-Write Detection—Software polling the BUSY bit in
status register, busy status readout on SO pin
Software Write Protection—Write protection through
block-protection bits in status register
One-Time Programmable Memory
The processors have 64K bits of one-time programmable non-
volatile memory that can be programmed by the developer only
once. It includes the array and logic to support read access and
programming. Additionally, its pages can be write protected.
The OTP memory allows both public and private data to be
stored on-chip. In addition to storing public and private key
data for applications requiring security, OTP allows developers
to store completely user-definable data such as customer ID,
product ID, and MAC address. Therefore, generic parts can be
supplied which are then programmed and protected by the
developer within this non-volatile memory.
I/O Memory Space
The processors do not define a separate I/O space. All resources
are mapped through the flat 32-bit address space. On-chip I/O
devices have their control registers mapped into memory-
mapped registers (MMRs) at addresses near the top of the
4G byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func-
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The MMRs are accessible only in supervisor mode and appear
as reserved space to on-chip peripherals.
Booting from ROM
The processors contain a small on-chip boot kernel, which con-
figures the appropriate peripheral for booting. If the processors
are configured to boot from boot ROM memory space, the pro-
cessor starts executing from the on-chip boot ROM. For more
information, see Booting Modes on Page 14.
EVENT HANDLING
The event controller handles all asynchronous and synchronous
events to the processor. The processors provide event handling
that supports both nesting and prioritization. Nesting allows
multiple event service routines to be active simultaneously.
Prioritization ensures that servicing of a higher priority event
takes precedence over servicing of a lower priority event. The
controller provides support for five different types of events:
Emulation—An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor through the JTAG interface.
Reset—This event resets the processor.
Nonmaskable Interrupt (NMI)—The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
Exceptions—Events that occur synchronously to program
flow; that is, the exception is taken before the instruction is
allowed to complete. Conditions such as data alignment
violations and undefined instructions cause exceptions.
Interrupts—Events that occur asynchronously to program
flow. They are caused by input signals, timers, and other
peripherals, as well as by an explicit software instruction.
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processor is saved on the
supervisor stack.
The event controller consists of two stages, the core event con-
troller (CEC) and the system interrupt controller (SIC). The
core event controller works with the system interrupt controller
to prioritize and control all system events. Conceptually, inter-
rupts from the peripherals enter into the SIC, and are then
routed directly into the general-purpose interrupts of the CEC.
Core Event Controller (CEC)
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest priority
interrupts (IVG15–14) are recommended to be reserved for
software interrupt handlers, leaving seven prioritized interrupt
inputs to support the peripherals of the processors. The inputs
to the CEC, identifies their names in the event vector table
(EVT), and lists their priorities are described in the
ADSP-BF51x Blackfin Processor Hardware Reference Manual
“System Interrupts” chapter.
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| ADSP-BF512BSWZ-4 | 功能描述:IC DSP 16/32B 400MHZ LP 176LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:Blackfin® 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
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| ADSP-BF512FBSWZ-3 | 制造商:Analog Devices 功能描述: |
| ADSP-BF512FKBCZ-3 | 制造商:Analog Devices 功能描述: |
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