參數(shù)資料
型號: ADSP-BF537BBCZ-5BV
廠商: Analog Devices Inc
文件頁數(shù): 60/68頁
文件大?。?/td> 0K
描述: IC DSP CTLR 16BIT 208CSPBGA
產(chǎn)品培訓(xùn)模塊: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點(diǎn)
接口: CAN,SPI,SSP,TWI,UART
時(shí)鐘速率: 533MHz
非易失內(nèi)存: 外部
芯片上RAM: 132kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.25V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 208-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 208-CSPBGA
包裝: 托盤
配用: ADZS-BF537-ASKIT-ND - BOARD EVAL SKIT ADSP-BF537
ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BF537-EZLITE-ND - BOARD EVAL ADSP-BF537
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADZS-BF537-STAMP-ND - SYSTEM DEV FOR ADSP-BF537
Rev. J
|
Page 63 of 68
|
February 2014
OUTLINE DIMENSIONS
Dimensions in Figure 67 and Figure 68 are shown in
millimeters.
Figure 67. 182-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-182)
Dimensions shown in millimeters
DETAIL A
0.50
0.45
0.40
1.31
1.21
1.10
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14 13 12 11 10
8 7 6
3 2 1
95 4
A1 CORNER
INDEX AREA
TOP VIEW
BOTTOM VIEW
1.70 MAX
12.00 BSC SQ
(BALL
DIAMETER)
SEATING
PLANE
0.25 MIN
0.12
COPLANARITY
PIN A1
INDICATOR
LOCATION
NOTES:
0.80
BSC
TYP
1. COMPLIANT TO JEDEC STANDARD MO-205-AE,
EXCEPT FOR BALL DIAMETER.
2. CENTER DIMENSIONS ARE NOMINAL.
3. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES
10.40
BSC
SQ
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