參數(shù)資料
型號: ADSP-BF537KBCZ-6BV
廠商: Analog Devices Inc
文件頁數(shù): 28/68頁
文件大?。?/td> 0K
描述: IC DSP CTLR 16BIT 208CSPBGA
產(chǎn)品培訓(xùn)模塊: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點
接口: CAN,SPI,SSP,TWI,UART
時鐘速率: 600MHz
非易失內(nèi)存: 外部
芯片上RAM: 132kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.30V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 208-LFBGA,CSPBGA
供應(yīng)商設(shè)備封裝: 208-CSPBGA
包裝: 托盤
配用: ADZS-BF537-ASKIT-ND - BOARD EVAL SKIT ADSP-BF537
ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BF537-EZLITE-ND - BOARD EVAL ADSP-BF537
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADZS-BF537-STAMP-ND - SYSTEM DEV FOR ADSP-BF537
Rev. J
|
Page 34 of 68
|
February 2014
SDRAM Interface Timing
Table 27. SDRAM Interface Timing
Parameter
Min
Max
Unit
Timing Requirements
tSSDAT
DATA15–0 Setup Before CLKOUT
1.5
ns
tHSDAT
DATA15–0 Hold After CLKOUT
0.8
ns
Switching Characteristics
tDCAD
COMMAND
1, ADDR19–1, DATA15–0 Delay After CLKOUT
1 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
4.0
ns
tHCAD
COMMAND
1, ADDR19–1, DATA15–0 Hold After CLKOUT
1.0
ns
tDSDAT
DATA15–0 Disable After CLKOUT
6.0
ns
tENSDAT
DATA15–0 Enable After CLKOUT
0.5
ns
tSCLK
2
2 These limits are specific to the SDRAM interface only. In addition, CLKOUT must always comply with the limits in Table 14 on Page 24.
CLKOUT Period when TJ +105
°C7.5
ns
tSCLK
CLKOUT Period when TJ +105
°C10
ns
tSCLKH
CLKOUT Width High
2.5
ns
tSCLKL
CLKOUT Width Low
2.5
ns
Figure 14. SDRAM Interface Timing
tSCLK
CLKOUT
tSCLKL
tSCLKH
tSSDAT
tHSDAT
tENSDAT
tDCAD
tDSDAT
tHCAD
tDCAD
tHCAD
DATA (IN)
DATA (OUT)
COMMAND,
ADDRESS
(OUT)
NOTE: COMMAND =
SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
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ADSP-BF538BBCZ-4A 功能描述:IC DSP CTLR 16BIT 316CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤