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參數(shù)資料
型號: ADSP-TS201SABP-050
廠商: Analog Devices Inc
文件頁數(shù): 35/48頁
文件大?。?/td> 0K
描述: IC PROCESSOR 500MHZ 576BGA
標(biāo)準(zhǔn)包裝: 1
系列: TigerSHARC®
類型: 定點/浮點
接口: 主機接口,連接端口,多處理器
時鐘速率: 500MHz
非易失內(nèi)存: 外部
芯片上RAM: 3MB
電壓 - 輸入/輸出: 2.50V
電壓 - 核心: 1.05V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 576-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 576-BGA-ED(25x25)
包裝: 托盤
配用: ADZS-TS201S-EZLITE-ND - KIT LITE EVAL FOR ADSP-TS201S
Rev. C
|
Page 40 of 48
|
December 2006
ADSP-TS201S
ENVIRONMENTAL CONDITIONS
The ADSP-TS201S processor is rated for performance under
TCASE environmental conditions specified in the Operating Con-
Thermal Characteristics
The ADSP-TS201S processor is packaged in a 25 mm × 25 mm,
thermally enhanced ball grid array (BGA_ED). The
ADSP-TS201S processor is specified for a case temperature
(TCASE). To ensure that the TCASE data sheet specification is not
exceeded, a heat sink and/or an air flow source may be required.
Table 34 shows the thermal characteristics of the 25 mm ×
25 mm BGA_ED package. All parameters are based on a
JESD51-9 four-layer 2s2p board. All data are based on 3 W
power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm
Package
Parameter
Condition
Typical
Unit
θJA1
1
θJA measured per JEDEC standard JESD51-6.
Airflow = 0 m/s
12.9
2
θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
mounted boards, use 17.0°C/W for 0 m/s.
°C/W
Airflow = 1 m/s
10.2
°C/W
Airflow = 2 m/s
9.0
°C/W
Airflow = 3 m/s
8.0
°C/W
θJB3
3
θJB measured per JEDEC standard JESD51-9.
—7.7
°C/W
θJC4
4
θJC measured by cold plate test method (no approved JEDEC standard).
—0.7
°C/W
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