參數(shù)資料
型號(hào): ADSP-TS201SABP-050
廠商: Analog Devices Inc
文件頁(yè)數(shù): 40/48頁(yè)
文件大?。?/td> 0K
描述: IC PROCESSOR 500MHZ 576BGA
標(biāo)準(zhǔn)包裝: 1
系列: TigerSHARC®
類型: 定點(diǎn)/浮點(diǎn)
接口: 主機(jī)接口,連接端口,多處理器
時(shí)鐘速率: 500MHz
非易失內(nèi)存: 外部
芯片上RAM: 3MB
電壓 - 輸入/輸出: 2.50V
電壓 - 核心: 1.05V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 576-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 576-BGA-ED(25x25)
包裝: 托盤
配用: ADZS-TS201S-EZLITE-ND - KIT LITE EVAL FOR ADSP-TS201S
ADSP-TS201S
Rev. C
|
Page 45 of 48
|
December 2006
OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IMET ERS.
2. THE ACTUAL PO SITION OF THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFO RMS TO JEDEC MS-034 SPECIF ICATIO N.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
7
95
3
1
11
13
15
17
21 19
23
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Table 36. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
576-Ball BGA_ED
(BP-576)
Nonsolder Mask Defined (NSMD)
0.69 mm diameter
0.56 mm diameter
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