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參數(shù)資料
| 型號： | ADUC832BSZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 84/92頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC/DAC 12BIT W/MCU 52MQFP |
| 產(chǎn)品培訓模塊： | Process Control |
| 標準包裝： | 1 |
| 系列： | MicroConverter® ADuC8xx |
| 核心處理器： | 8052 |
| 芯體尺寸： | 8-位 |
| 速度： | 16MHz |
| 連通性： | EBI/EMI，I²C，SPI，UART/USART |
| 外圍設(shè)備： | PSM，溫度傳感器，WDT |
| 輸入/輸出數(shù)： | 34 |
| 程序存儲器容量： | 62KB（62K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 4K x 8 |
| RAM 容量： | 2.25K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b，D/A 2x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 52-QFP |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 738 (CN2011-ZH PDF) |
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Data Sheet
ADuC832
Rev. B | Page 85 of 92
GROUNDING AND BOARD LAYOUT
RECOMMENDATIONS
As with all high resolution data converters, special attention
must be paid to grounding and PCB layout of ADuC832- based
designs to achieve optimum performance from the ADC and
DACs. Although the ADuC832 has separate pins for analog and
digital ground (AGND and DGND), the user must not tie these
to two separate ground planes unless the two ground planes are
connected together very close to the ADuC832, as illustrated in
the simplified example of Figure 93a. In systems where digital
and analog ground planes are connected together at some other
location (at the system’s power supply, for example), they cannot
be connected again near the ADuC832 because a ground loop then
results. In these cases, tie all the ADuC832 AGND and DGND
pins to the analog ground plane, as illustrated in Figure 93b. In
systems with only one ground plane, ensure that the digital and
analog components are physically separated onto separate halves
of the board such that digital return currents do not flow near
analog circuitry and vice versa. The ADuC832 can then be
placed between the digital and analog sections, as illustrated in
In all of these scenarios, and in more complicated real-life
applications, keep in mind the flow of current from the supplies
and back to ground. Make sure the return paths for all currents
are as close as possible to the paths the currents traveled to reach
their destinations. For example, do not power components on
return currents from DVDD to flow through AGND. Also, try
to avoid digital currents flowing under analog circuitry, which
may happen if the user places a noisy digital chip on the left
half of the board in Figure 93c. Whenever possible, avoid large
discontinuities in the ground plane(s) (such as are formed by a
long trace on the same layer), because they force return signals
to travel a longer path. Also, make all connections to the ground
plane directly, with little or no trace separating the pin from its
via to ground.
To connect fast logic signals (rise/fall time < 5 ns) to any of the
ADuC832 digital inputs, add a series resistor to each relevant
line to keep rise and fall times longer than 5 ns at the ADuC832
input pins. A value of 100 Ω or 200 Ω is usually sufficient to
prevent high speed signals from coupling capacitively into the
ADuC832 and affecting the accuracy of ADC conversions.
b.
DGND
AGND
c.
GND
a.
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS
HERE
DGND
AGND
02
98
7-
0
81
Figure 93. System Grounding Schemes
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