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參數(shù)資料
| 型號(hào)： | AGLP125V5-CSG289I |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 3120 CLBS, 125000 GATES, PBGA289 |
| 封裝： | 14 X 14 MM, 1.2 MM HEIGHT, 0.8 MM PITCH, ROHS COMPLIANT, CSP-289 |
| 文件頁(yè)數(shù)： | 42/128頁(yè) |
| 文件大?。?/td> | 4383K |
| 代理商： | AGLP125V5-CSG289I |
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IGLOO PLUS DC and Switching Characteristics
2- 6
R ev isio n 1 1
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
201
TBD
C/W
281
TBD
C/W
289
TBD
C/W
Very Thin Quad Flat Package (VQFP)
128
TBD
C/W
176
TBD
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AGLP125V5-CSG289 | FPGA, 3120 CLBS, 125000 GATES, PBGA289 |
| AGLP125V5CS281I | FPGA, 3120 CLBS, 125000 GATES, PBGA281 |
| AGLP125V5CS281 | FPGA, 3120 CLBS, 125000 GATES, PBGA281 |
| AGLP125V5CS289I | FPGA, 3120 CLBS, 125000 GATES, PBGA289 |
| AGLP125V5CS289 | FPGA, 3120 CLBS, 125000 GATES, PBGA289 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AGLP125-V5CSG289PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125V5-FCS281 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOO PLUS 125K GATES 1024 CELLS 130NM 1.5V 281CSP - Trays |
| AGLP125-V5FCS289 | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP125V5-FCS289 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOO PLUS 125K GATES 1024 CELLS 130NM 1.5V 289CSP - Trays |
| AGLP125-V5FCS289ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
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