參數(shù)資料
型號: AT30TS750-MA8-T
廠商: ATMEL CORP
元件分類: 溫度/濕度傳感器
英文描述: DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 3Cel, RECTANGULAR, SURFACE MOUNT
封裝: 2 X 3 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8
文件頁數(shù): 42/52頁
文件大小: 1369K
代理商: AT30TS750-MA8-T
Atmel AT30TS750 [Preliminary]
14.2
8XM – MSOP
TITLE
DRAWING NO.
GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8XM
TZD
A
8XM, 8-lead, 3.0x3.0mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP/MSOP)
3/1/11
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A
-
1.10
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.22
-
0.38
D
2.90
3.00
3.10
1
E
4.90 BSC
E1
2.90
3.00
3.10
1
e
0.65 BSC
L
0.40
0.55
0.80
2
A
e
OC
C
A1
N
Pin 1
E
1
A
2
3
SIDE VIEW
END VIEW
DETAIL 'A'
TOP VIEW
SEATING
PLANE
1
2
3
SEE
DETAIL "A"
2
L
4
1.
ONE ANOTHER WITHIN 0.10mm AT SEATING PLANE.
4.
3.
2.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
AT DATUM PLANE -H- , MOLD FLASH OR
FLASH OR PROTRUSIONS, AND ARE MEASURED
DIMENSIONS "D" & "E1" DO NOT INCLUDE MOLD
NOTES:
C
0.10
C
L
BSC
0.25
D
C
0.20
B A
2X
(N/2 TIPS)
E1
0.07 R. MIN
2 PLACES
-C-
SEATING PLANE
-H-
-A-
-B-
S
0.05
5. DATUMS -A- AND -B- TO BE DETERMINED BY DATUM
PLANE -H- .
BOTTOM VIEW
N
3
2
1
C
O
b
8749A-DTS-03/11
47
R
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