參數資料
型號: C9815DY
英文描述: Up to 5A ULDO linear regulator
中文描述: CPU系統時鐘發(fā)生器| SSOP封裝| 56PIN |塑料
文件頁數: 16/19頁
文件大?。?/td> 328K
代理商: C9815DY
Low EMI Clock Generator for Intel
133MHz/2DIMM Chipset Systems
Cypress Semiconductor Corporation
525 Los Coches St.
Milpitas, CA 95035. Tel: 408-263-6300, Fax: 408-263-6571
http://www.cypress.com
Document#: 38-07054 Rev. **
05/03/2001
Page 16 of 19
APPROVED PRODUCT
C9815
Suggested Oscillator Crystal Parameters
Characteristic
Symbol
Frequency
F
o
Tolerance
T
C
T
S
T
A
Operating Mode
-
Load Capacitance
C
XTAL
Effective Series
Resistance (ESR)
Note1: For best performance and accurate frequencies from this device, It is recommended but not mandatory that the
chosen crystal meets or exceeds these specifications
Note 2: Larger values may cause this device to exhibit oscillator startup problems
Min
12.00
-
-
-
-
-
-
Typ
Max
16.00
+/-100
+/- 100
5
-
-
-
Units
MHz
PPM
PPM
PPM
Conditions
14.31818
-
-
-
-
20
40
Note 1
Stability (T
A
-10 to +60C) Note 1
Aging (first year @ 25C) Note 1
Parallel Resonant, Note 1
The crystal
s rated load. Note 1
Note 2
pF
R
ESR
Ohms
To obtain the maximum accuracy, the total circuit loading capacitance should be equal to C
XTAL
. This loading
capacitance is the effective capacitance across the crystal pins and includes the clock generating device pin
capacitance (C
FTG
), any circuit traces (C
PCB
), and any onboard discrete load capacitors (C
DISC
).
The following formula and schematic may be used to understand and calculate either the loading specification of a crystal for a
design or the additional discrete load capacitance that must be used to provide the correct load to a known load rated crystal.
C
L
= (C
XINPCB
+ C
XINFTG
+ C
XINDISC
) X (C
XOUTPCB
+ C
XOUTFTG
+ C
XOUTDISC
)
(C
XINPCB
+ C
XINFTG
+ C
XINDISC
) + (C
XOUTPCB
+ C
XOUTFTG
+ C
OUTDISC
)
Where:
C
XTAL
= the load rating of the crystal
C
XOUTFTG
= the clock generators XIN pin effective device internal capacitance to ground
C
XOUTFTG
= the clock generators XOUT pin effective device internal capacitance to ground
C
XINPCB
= the effective capacitance to ground of the crystal to device PCB trace
C
XOUTPCB
= the effective capacitance to ground of the crystal to device PCB trace
C
XINDISC
= any discrete capacitance that is placed between the XIN pin and ground
C
XOUTDISC
= any discrete capacitance that is placed between the XOUT pin and ground
C
XINPCB
C
XOUTPCB
C
XOUTDISC
C
XINDISC
C
XINFTG
C
XOUTFTG
XIN
XOUT
Clock Generator
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