(3) MSL, Peak Temp. - The Moisture Sensitivity " />
參數(shù)資料
型號(hào): COP8CDR9HVA8/NOPB
廠商: National Semiconductor
文件頁(yè)數(shù): 9/111頁(yè)
文件大?。?/td> 0K
描述: IC MCU CMOS 8BIT 44-PLCC
標(biāo)準(zhǔn)包裝: 25
系列: COP8™ 8C
核心處理器: COP8
芯體尺寸: 8-位
速度: 20MHz
連通性: Microwire/Plus(SPI),UART/USART
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 37
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 1K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-LCC(J 形引線)
包裝: 管件
其它名稱: *COP8CDR9HVA8
*COP8CDR9HVA8/NOPB
COP8CDR9HVA8
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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