參數(shù)資料
型號: DSP56321VL220
廠商: Freescale Semiconductor
文件頁數(shù): 15/84頁
文件大小: 0K
描述: IC DSP 24BIT 220MHZ 196-MAPBGA
標準包裝: 126
系列: DSP56K/Symphony
類型: 定點
接口: 主機接口,SSI,SCI
時鐘速率: 220MHz
非易失內(nèi)存: ROM(576 B)
芯片上RAM: 576kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.60V
工作溫度: -40°C ~ 100°C
安裝類型: 表面貼裝
封裝/外殼: 196-FBGA
供應商設備封裝: 196-MAPBGA(15x15)
包裝: 托盤
DSP56321 Technical Data, Rev. 11
2-2
Freescale Semiconductor
Specifications
2.2 Thermal Characteristics
2.3 DC Electrical Characteristics
Table 2-2.
Thermal Characteristics
Thermal Resistance Characteristic
Symbol
MAP-BGA
Value
Unit
Junction-to-ambient, natural convection, single-layer board (1s)1,2
RθJA
44
°C/W
Junction-to-ambient, natural convection, four-layer board (2s2p)1,3
RθJMA
25
°C/W
Junction-to-ambient, @200 ft/min air flow, single-layer board (1s)1,3
RθJMA
35
°C/W
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)1,3
RθJMA
22
°C/W
Junction-to-board
4
RθJB
13
°C/W
Junction-to-case thermal resistance
5
RθJC
7
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3.
Per JEDEC JESD51-6 with the board horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Table 2-3.
DC Electrical Characteristics7
Characteristics
Symbol
Min
Typ
Max
Unit
Supply voltage
1:
Core (VCCQL)
I/O (VCCQH, VCCA, VCCD, VCCC, VCCH, and VCCS)
1.5
3.0
1.6
3.3
1.7
3.6
V
Input high voltage
D[0–23], BG, BB, TA
MOD/IRQ
2 RESET, PINIT/NMI and all
JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL9
VIH
VIHP
VIHX
2.0
0.8
× VCCQH
VCCQH + 0.3
VCCQH
V
Input low voltage
D[0–23], BG, BB, TA, MOD/IRQ2, RESET, PINIT
All JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL9
VIL
VILP
VILX
–0.3
0.8
0.2
× V
CCQH
V
Input leakage current
IIN
–10
10
A
High impedance (off-state) input current
(@ 2.4 V / 0.4 V)
ITSI
–10
10
A
Output high voltage8
TTL (IOH = –0.4 mA)
6
CMOS (IOH = –10 A)
6
VOH
2.4
VCCQH – 0.01
V
Output low voltage
8
TTL (IOL = 3.0 mA)
6
CMOS (IOL = 10 A)
6
VOL
0.4
0.01
V
相關PDF資料
PDF描述
MAX6655MEE+T IC TEMP SENSOR 4CH 16-QSOP
EP1K30FC256-2N IC ACEX 1K FPGA 30K 256-FBGA
RS3-1212S/H3 CONV DC/DC 3W 9-18VIN 12VOUT
VE-B12-CV-F3 CONVERTER MOD DC/DC 15V 150W
MAX6699UE34+T IC TEMP MONITOR 5CH 16TSSOP
相關代理商/技術參數(shù)
參數(shù)描述
DSP56321VL240 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSP56321VL275 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSP56321VL275 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor (DSP) IC
DSP56362 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor
DSP56362AD 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:24-Bit Audio Digital Signal Processor