參數(shù)資料
型號(hào)： DSP56321VL220
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 58/84頁(yè)
文件大?。?/td> 0K
描述： IC DSP 24BIT 220MHZ 196-MAPBGA
標(biāo)準(zhǔn)包裝： 126
系列： DSP56K/Symphony
類(lèi)型： 定點(diǎn)
接口： 主機(jī)接口，SSI，SCI
時(shí)鐘速率： 220MHz
非易失內(nèi)存： ROM（576 B）
芯片上RAM： 576kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.60V
工作溫度： -40°C ~ 100°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 196-FBGA
供應(yīng)商設(shè)備封裝： 196-MAPBGA（15x15）
包裝： 托盤(pán)
DSP56321 Technical Data, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56321 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in ° C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
相關(guān)PDF資料
PDF描述
MAX6655MEE+T IC TEMP SENSOR 4CH 16-QSOP
EP1K30FC256-2N IC ACEX 1K FPGA 30K 256-FBGA
RS3-1212S/H3 CONV DC/DC 3W 9-18VIN 12VOUT
VE-B12-CV-F3 CONVERTER MOD DC/DC 15V 150W
MAX6699UE34+T IC TEMP MONITOR 5CH 16TSSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSP56321VL240 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL275 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321VL275 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor (DSP) IC
DSP56362 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:24-Bit Audio Digital Signal Processor
DSP56362AD 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:24-Bit Audio Digital Signal Processor
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*