參數(shù)資料
型號(hào)： DSP56F807VF80E
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 15/60頁(yè)
文件大小： 0K
描述： IC DSP 80MHZ 60K FLASH 160-BGA
標(biāo)準(zhǔn)包裝： 126
系列： 56F8xx
核心處理器： 56800
芯體尺寸： 16-位
速度： 80MHz
連通性： CAN，EBI/EMI，SCI，SPI
外圍設(shè)備： POR，PWM，WDT
輸入/輸出數(shù)： 32
程序存儲(chǔ)器容量： 136KB（68K x 16）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 6K x 16
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 16x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 160-BGA
包裝： 托盤(pán)
56F807 Technical Data Technical Data, Rev. 16
22
Freescale Semiconductor
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2.
Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
3.
Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Voltage difference VSS to VSSA
ΔV
SS
-0.1
-
0.1
V
ADC reference voltage
VREF
2.7
–
VDDA
V
Ambient operating temperature
TA
–40
–
85
°C
Table 3-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
160-pin
LQFP
160
MBGA
Junction to ambient
Natural convection
RθJA
38.5
63.4
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
35.4
60.3
°C/W
2
Junction to ambient
Natural convection
Four layer
board (2s2p)
RθJMA
(2s2p)
33
49.9
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer
board (2s2p)
RθJMA
31.5
46.8
°C/W
1,2
Junction to case
RθJC
8.6
8.1
°C/W
3
Junction to center of case
Ψ
JT
0.8
0.6
°C/W
4, 5
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Junction to center of case
PDMAX
(TJ - TA) /R
θJA
W7
Table 3-2 Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
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