參數資料
型號: DSP56F826BU80
廠商: Freescale Semiconductor
文件頁數: 21/56頁
文件大小: 0K
描述: IC DSP 80MHZ 64KB FLASH 100LQFP
標準包裝: 90
系列: 56F8xx
核心處理器: 56800
芯體尺寸: 16-位
速度: 80MHz
連通性: EBI/EMI,SCI,SPI,SSI
外圍設備: POR,WDT
輸入/輸出數: 46
程序存儲器容量: 67KB(33.5K x 16)
程序存儲器類型: 閃存
RAM 容量: 4.5K x 16
電壓 - 電源 (Vcc/Vdd): 2.25 V ~ 2.75 V
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-LQFP
包裝: 托盤
56F826 Technical Data, Rev. 14
28
Freescale Semiconductor
Figure 3-8 Flash Mass Erase Cycle
3.6 External Clock Operation
The 56F826 system clock can be derived from a crystal or an external system clock signal. To generate a
reference frequency using the internal oscillator, a reference crystal must be connected between the
EXTAL and XTAL pins.
3.6.1
Crystal Oscillator
The internal oscillator is also designed to interface with a parallel-resonant crystal resonator in the
frequency range specified for the external crystal in Table 3-9. A recommended crystal oscillator circuit
is shown in Figure 3-9. Follow the crystal supplier’s recommendations when selecting a crystal, because
crystal parameters determine the component values required to provide maximum stability and reliable
start-up. The crystal and associated components should be mounted as close as possible to the EXTAL
and XTAL pins to minimize output distortion and start-up stabilization time.The internal 56F82x
oscillator circuitry is designed to have no external load capacitors present. As shown in Figure 3-9, no
external load capacitors should be used.
The 56F80x components internally are modeled as a parallel resonant oscillator circuit to provide a
capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and
process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF
XADR
YE=SE=OE=0
ERASE
NVSTR
Tnvs
Tnvh1
Trcv
Tme
MAS1
IFREN
XE
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