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| 型號： | DSP56F827FG80 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 16-bit Digital Signal Controllers |
| 中文描述： | 16位數(shù)字信號控制器 |
| 文件頁數(shù)： | 55/60頁 |
| 文件大?。?/td> | 811K |
| 代理商： | DSP56F827FG80 |
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Thermal Design Considerations
56F827 Technical Data, Rev. 12
Freescale Semiconductor
55
Part 5 Design Considerations
5.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, in
°
C can be obtained from the equation:
Equation 1:
Where:
T
A
= ambient temperature °C
R
θ
JA
= package junction-to-ambient thermal resistance °C/W
P
D
= power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance:
Equation 2:
Where:
R
θ
JA
= package junction-to-ambient thermal resistance °C/W
R
θ
JC
= package junction-to-case thermal resistance °C/W
R
θ
CA
= package case-to-ambient thermal resistance °C/W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R
θ
CA
. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system-level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from R
θ
JA
do not satisfactorily answer whether
the thermal performance is adequate, a system-level model may be appropriate.
Definitions:
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the
chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation
across the surface.
T
J
T
A
P
D
R
θ
JA
×
(
)
+
=
R
θ
JA
R
θ
JC
R
θ
CA
+
=
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DSP56F827FG80E | 16-bit Digital Signal Controllers |
| DSP56F827 | 16-bit Hybrid Controller(16位混合控制器) |
| DSP8-08AC | Phase-leg Rectifier Diode ISOPLUS220 |
| DSP8-08 | Phase-leg Rectifier Diode |
| DSP8-08AS | Phase-leg Rectifier Diode |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSP56F827FG80E | 功能描述:16位微控制器 - MCU 80Mhz/40MIPS RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT |
| DSP56F827FG80E | 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor IC DSP Type:Cor |
| DSP56F827FG80E | 制造商:Freescale Semiconductor 功能描述:DSP LQFP128 3.6V |
| DSP56F827PB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56F827 16-Bit Hybrid Controller Product Brief |
| DSP56F827PB/D | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:56F827 16-bit Hybrid Controller |
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