參數(shù)資料
型號: EDE1116ABSE-4A-E
廠商: ELPIDA MEMORY INC
元件分類: DRAM
英文描述: 1G bits DDR2 SDRAM
中文描述: 64M X 16 DDR DRAM, 0.6 ns, PBGA92
封裝: ROHS COMPLIANT, FBGA-92
文件頁數(shù): 15/82頁
文件大小: 618K
代理商: EDE1116ABSE-4A-E
EDE1104ABSE, EDE1108ABSE, EDE1116ABSE
Data Sheet E0852E50 (Ver. 5.0)
15
-8E
-6C, -6E
Frequency (Mbps)
800
667
Parameter
Symbol
min.
max.
min.
max.
Unit
Notes
Active bank A to active bank B command
period
(EDE1104AB, EDE1108AB)
(EDE1116AB)
Four active window period
(EDE1104AB, EDE1108AB)
(EDE1116AB)
tRRD
7.5
7.5
ns
tRRD
10
ns
tFAW
35
37.5
ns
tFAW
50
ns
/CAS to /CAS command delay
tCCD
2
2
nCK
Write recovery time
Auto precharge write recovery + precharge
time
Internal write to read command delay
tWR
15
WR
+
RU
(tRP/tCK(avg))
7.5
15
WR
+
RU
(tRP/tCK(avg))
7.5
ns
tDAL
nCK
1, 9
tWTR
ns
Internal read to precharge command delay
tRTP
7.5
7.5
ns
Exit self-refresh to a non-read command
tXSNR
tRFC
+
10
tRFC + 10
ns
Exit self-refresh to a read command
Exit precharge power-down to any non-read
command
Exit active power-down to read command
Exit active power-down to read command
(slow exit/low power mode)
CKE minimum pulse width (high and low
pulse width)
Output impedance test driver delay
tXSRD
200
200
nCK
tXP
2
2
nCK
tXARD
2
2
nCK
3
tXARDS
8
AL
7
AL
nCK
2, 3
tCKE
3
3
nCK
tOIT
0
12
0
12
ns
MRS command to ODT update delay
Auto-refresh to active/auto-refresh
command time
Average periodic refresh interval
(0
°
C
TC
+85
°
C)
(+85
°
C
<
TC
+95
°
C)
Minimum time clocks remains ON after CKE
asynchronously drops low
t
MOD
0
12
0
12
ns
tRFC
127.5
127.5
ns
tREFI
7.8
7.8
μ
s
tREFI
tIS
+
tCK(avg)
+
tIH
3.9
tIS
+
tCK(avg)
+
tIH
3.9
μ
s
tDELAY
ns
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