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參數(shù)資料
| 型號： | Embedded Pentium 133 |
| 廠商： | Intel Corp. |
| 英文描述： | 32 BIT Embedded Pentium Processor(32位嵌入式奔騰處理器) |
| 中文描述： | 32位嵌入式奔騰處理器（32位嵌入式奔騰處理器） |
| 文件頁數(shù)： | 26/42頁 |
| 文件大?。?/td> | 882K |
| 代理商： | EMBEDDED PENTIUM 133 |
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Embedded Pentium
Processor
26
Datasheet
2.3
Thermal Specifications
The Pentium processor is specified for proper operation when case temperature, T
CASE
(T
C
), is
within the specified range of 0° C to 70° C.
The power dissipation specification in Table 13 is provided for designing thermal solutions for
operation at a sustained maximum level. This is the worst-case power the device would dissipate in
a system. This number is used for design of a thermal solution for the device.
2.3.1
Measuring Thermal Values
To verify that the proper T
C
(case temperature) is maintained, it should be measured at the center of
the package top surface (opposite of the pins). The measurement is made in the same way with or
without a heatsink attached. When a heatsink is attached, a hole (0.150" diameter or smaller)
should be drilled through the heatsink to allow a probe to touch the center of the package. See
Figure 5 for an illustration of how to measure T
C
.
To minimize the measurement errors, use the following approach:
Use 36-gauge or finer diameter K, T, or J type thermocouples.
Attach the thermocouple bead or junction to the center of the package top surface using high
thermal conductivity cements.
Attach the thermocouple at a 90-degree angle as shown in Figure 5.
The hole size should be 0.150" or less in diameter.
Table 13. Power Dissipation Requirements for Thermal Solution Design
Parameter
Typical
1
Max
Unit
Notes
Active Power Dissipation
5.4
4.3
3.9
14.5
2
11.2
3
10.1
3
Watts
166 MHz
133 MHz
100 MHz
Stop Grant and Auto Halt Powerdown
Power Dissipation
2.1
1.7
1.55
Watts
166 MHz, Note 4
133 MHz, Note 4
100 MHz, Note 4
Stop Clock Power Dissipation
0.02
<0.3
Watts
Note 5
NOTES:
1. This is the typical power dissipation in a system. This value was the average value measured in a system
using a typical device at nominal V
CC
(3.3 V for 100 and 133 MHz processors and 3.5 V for 166 MHz
processors) running typical applications. This value is highly dependent upon the specific system
configuration.
2. Systems must be designed to thermally dissipate the maximum active power of the device. It is
determined using a worst-case instruction mix with V
CC
=3.5 V, and also takes into account the thermal
time constants of the package.
3. Systems must be designed to thermally dissipate the maximum active power of the device. It is
determined using a worst case instruction mix with V
CC
= 3.3 V and also takes into account the thermal
time constants of the package.
4. Stop Grant/Auto Halt Powerdown power dissipation is determined by asserting the STPCLK# pin or
executing the HALT instruction.
5. Stop Clock power dissipation is determined by asserting the STPCLK# pin and then removing the
external CLK input.
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