參數(shù)資料
型號: EP2AGX125DF25C6N
廠商: Altera
文件頁數(shù): 13/90頁
文件大小: 0K
描述: IC ARRIA II GX FPGA 125K 572FBGA
產(chǎn)品培訓(xùn)模塊: Arria II GX FPGA
Three Reasons to Use FPGA's in Industrial Designs
特色產(chǎn)品: Arria? II GX FPGAs
標(biāo)準(zhǔn)包裝: 5
系列: Arria II GX
LAB/CLB數(shù): 4964
邏輯元件/單元數(shù): 118143
RAM 位總計: 8315904
輸入/輸出數(shù): 260
電源電壓: 0.87 V ~ 0.93 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 572-FBGA
供應(yīng)商設(shè)備封裝: 572-FBGA
其它名稱: 544-2595-5
EP2AGX125DF25C6NES
EP2AGX125DF25C6NES-ND
1–12
Chapter 1: Device Datasheet for Arria II Devices
Electrical Characteristics
December 2013
Altera Corporation
Use the following with Equation 1–1:
RSCAL is the OCT resistance value at power up.
T is the variation of temperature with respect to the temperature at power up.
V is the variation of voltage with respect to the VCCIO at power up.
dR/dT is the percentage change of RSCAL with temperature.
dR/dV is the percentage change of RSCAL with voltage.
Table 1–14 lists the OCT variation with temperature and voltage after power-up
calibration for Arria II GX devices.
Table 1–15 lists the OCT variation with temperature and voltage after power-up
calibration for Arria II GZ devices.
Pin Capacitance
Table 1–16 lists the pin capacitance for Arria II GX devices.
Table 1–14. OCT Variation after Power-up Calibration for Arria II GX Devices
Nominal Voltage VCCIO (V)
dR/dT (%/°C)
dR/dV (%/mV)
3.0
0.262
0.035
2.5
0.234
0.039
1.8
0.219
0.086
1.5
0.199
0.136
1.2
0.161
0.288
Table 1–15. OCT Variation after Power-Up Calibration for Arria II GZ Devices (Note 1)
Nominal Voltage, V
CCIO (V)
dR/dT (%/°C)
dR/dV (%/mV)
3.0
0.189
0.0297
2.5
0.208
0.0344
1.8
0.266
0.0499
1.5
0.273
0.0744
1.2
0.317
0.1241
Note to Table 1–15:
(1) Valid for VCCIO range of ±5% and temperature range of 0° to 85°C.
Table 1–16. Pin Capacitance for Arria II GX Devices
Symbol
Description
Typical
Unit
CIO
Input capacitance on I/O pins, dual-purpose pins (differential I/O, clock,
Rup, Rdn), and dedicated clock input pins
7pF
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP2AGX125DF25C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
EP2AGX125DF25I3 功能描述:IC ARRIA II GX FPGA 125K 572FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Arria II GX 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
EP2AGX125DF25I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX125DF25I5 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX125DF25I5N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256