參數(shù)資料
型號: EP2AGX125DF25C6N
廠商: Altera
文件頁數(shù): 29/90頁
文件大小: 0K
描述: IC ARRIA II GX FPGA 125K 572FBGA
產(chǎn)品培訓模塊: Arria II GX FPGA
Three Reasons to Use FPGA's in Industrial Designs
特色產(chǎn)品: Arria? II GX FPGAs
標準包裝: 5
系列: Arria II GX
LAB/CLB數(shù): 4964
邏輯元件/單元數(shù): 118143
RAM 位總計: 8315904
輸入/輸出數(shù): 260
電源電壓: 0.87 V ~ 0.93 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 572-FBGA
供應商設(shè)備封裝: 572-FBGA
其它名稱: 544-2595-5
EP2AGX125DF25C6NES
EP2AGX125DF25C6NES-ND
Ch
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1:
De
vice
Da
ta
sh
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tfo
r
Arria
II
De
vice
s
1–2
7
Switc
h
ing
C
h
ar
acter
istics
Dec
ember
2013
Alte
ra
Cor
p
oration
A
Digital reset
pulse width
Minimum is 2 parallel clock cycles
Notes to Table 1–34:
(1) For AC-coupled links, the on-chip biasing circuit is switched off before and during configuration. Ensure that input specifications are not violated during this period.
(2) The rise/fall time is specified from 20% to 80%.
(3) To calculate the REFCLK rms phase jitter requirement at reference clock frequencies other than 100 MHz, use the following formula:
REFCLK rms phase jitter at f (MHz) = REFCLK rms phase jitter at 100 MHz * 100/f.
(4) The minimum reconfig_clk frequency is 2.5 MHz if the transceiver channel is configured in Transmitter only mode. The minimum reconfig_clk frequency is 37.5 MHz if the transceiver channel is
configured in Receiver only or Receiver and Transmitter mode. For more information, refer to AN 558: Implementing Dynamic Reconfiguration in Arria II Devices.
(5) If your design uses more than one dynamic reconfiguration controller instances (altgx_reconfig) to control the transceiver channels (altgx) physically located on the same side of the device, and if
you use different reconfig_clk sources for these altgx_reconfig instances, the delta time between any two of these reconfig_clk sources becoming stable must not exceed the maximum
specification listed.
(6) The device cannot tolerate prolonged operation at this absolute maximum.
(7) You must use the 1.1-V RX VICM setting if the input serial data standard is LVDS and the link is DC-coupled.
(8) The rate matcher supports only up to ±300 parts per million (ppm).
(9) Time taken to rx_pll_locked goes high from rx_analogreset de-assertion. Refer to Figure 1–1.
(10) The time in which the CDR must be kept in lock-to-reference mode after rx_pll_locked goes high and before rx_locktodata is asserted in manual mode. Refer to Figure 1–1.
(11) The time taken to recover valid data after the rx_locktodata signal is asserted in manual mode. Refer to Figure 1–1.
(12) The time taken to recover valid data after the rx_freqlocked signal goes high in automatic mode. Refer to Figure 1–2.
(13) To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
Table 1–34. Transceiver Specifications for Arria II GX Devices (Note 1) (Part 7 of 7)
Symbol/
Description
Condition
I3
C4
C5 and I5
C6
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP2AGX125DF25C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
EP2AGX125DF25I3 功能描述:IC ARRIA II GX FPGA 125K 572FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Arria II GX 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設(shè)備封裝:120-CPGA(34.55x34.55)
EP2AGX125DF25I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX125DF25I5 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EP2AGX125DF25I5N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256