TA = 25°C, unless otherwi" />
參數(shù)資料
型號(hào)： EVAL-AD5292EBZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 2/32頁(yè)
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD5292
標(biāo)準(zhǔn)包裝： 1
主要目的： 數(shù)字電位器
嵌入式： 是
已用 IC / 零件： AD5292
主要屬性： 1 通道，1024 位置
次要屬性： SPI 接口
已供物品： 板，CD
AD5291/AD5292
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8.
Parameter
Rating
VDD to GND
0.3 V to +35 V
VSS to GND
+0.3 V to 25 V
VLOGIC to GND
0.3 V to + 7 V
VDD to VSS
35 V
VA, VB, VW to GND
VSS 0.3 V, VDD+ 0.3 V
Digital Input and Output Voltage to GND
0.3 V to VLOGIC + 0.3 V
EXT_CAP Voltage to GND
0.3 V to +7 V
IA, IB, IW
Continuous
RAB = 20 kΩ
±3 mA
RAB = 50 kΩ, 100 kΩ
±2mA
Frequency > 10 kHz
Frequency ≤ 10 kHz
Operating Temperature Range4
40°C to +105°C
Maximum Junction Temperature (TJ max)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type
θJA
θJC
Unit
14-Lead TSSOP
20
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec to 1 m/sec air flow).
ESD CAUTION
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Maximum continuous current
3 Pulse duty factor.
4 Includes programming of OTP memory.
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