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參數(shù)資料
| 型號(hào)： | EVAL-AD7879EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 32/41頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR AD7879 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 接口，觸摸屏控制器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | AD7879 |
| 主要屬性： | 4 線電阻式觸控屏控制器，I²C 和 SPI 接口 |
| 次要屬性： | 圖形用戶界面，USB 接口 |
| 已供物品： | 板，線纜，CD，觸控屏 |
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AD7879/AD7889
Rev. C | Page 37 of 40
GROUNDING AND LAYOUT
For detailed information on grounding and layout considerations
for the AD7879/AD7889, refer to the AN-577 Application Note,
Layout and Grounding Recommendations for Touch Screen
Digitizers.
LEAD FRAME CHIP SCALE PACKAGES
The lands on the lead frame chip scale package (CP-16-10) are
rectangular. The printed circuit board (PCB) pad for these lands
should be 0.1 mm longer than the package land length and
0.05 mm wider than the package land width. Center the land on
the pad to maximize the solder joint size.
The bottom of the lead frame chip scale package has a central
thermal pad. The thermal pad on the PCB should be at least as
large as this exposed pad. To avoid shorting, provide a clearance
of at least 0.25 mm between the thermal pad and the inner
edges of the land pattern on the PCB. Thermal vias can be used
on the PCB thermal pad to improve the thermal performance of
the package. If vias are used, incorporate them into the thermal
pad at a 1.2 mm pitch grid. The via diameter should be between
0.3 mm and 0.33 mm, and the via barrel should be plated with
1 oz. of copper to plug the via.
Connect the PCB thermal pad to GND.
WLCSP ASSEMBLY CONSIDERATIONS
For detailed information on the WLCSP PCB assembly and
reliability, see the AN-617 Application Note, MicroCSP Wafer
Level Chip Scale Package.
NC = NO CONNECT
1
Y+
2
NC
3
NC
4
X–
11
NC
12
10
NC
9
DOUT
5
6
7
8
15
16
14
13
07667-
045
AD7879/
AD7889
PENIRQ/INT/DAV
Y–
DI
N
G
ND
SCL
V
CC
/RE
F
X+
AUX
/
VBA
T/
GP
IO
CS
TOUCH
SCREEN
0.1F
0.1F TO 10F
(OPTIONAL)
VOLTAGE
REGULATOR
MAIN
BATTERY
INT
SCLK
MISO
MOSI
SPI
IN
TE
R
F
ACE
HOST
CS
Figure 46. Typical Application Circuit
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EVAL-AD7887CB | 制造商:Analog Devices 功能描述:EVAL BD FOR 2.7 V TO 5.25 V, MICROPWR, 2CH, 125 KSPS, 12-BIT - Bulk |
| EVAL-AD7887CB4 | 制造商:AD 制造商全稱:Analog Devices 功能描述:2.7 V to 5.25 V, Micropower, 2-Channel, 125 kSPS, 12-Bit ADC in 8-Lead MSOP |
| EVAL-AD7887CBZ | 功能描述:BOARD EVAL FOR AD7887 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 模數(shù)轉(zhuǎn)換器 (ADC) 系列:* 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- ADC 的數(shù)量:1 位數(shù):12 采樣率（每秒）:94.4k 數(shù)據(jù)接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標(biāo)準(zhǔn)）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件 |
| EVAL-AD7888CB | 制造商:Analog Devices 功能描述:EVAL KIT FOR 2.7 V TO 5.25 V, MICROPWR, 8CH, 125 KSPS, 12-BI - Bulk |
| EVAL-AD7890-2 | 制造商:Analog Devices 功能描述:AD7890 EVAL BOARD |
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