• 參數(shù)資料
    型號(hào): EVAL-AD7879EBZ
    廠商: Analog Devices Inc
    文件頁(yè)數(shù): 33/41頁(yè)
    文件大?。?/td> 0K
    描述: BOARD EVALUATION FOR AD7879
    標(biāo)準(zhǔn)包裝: 1
    主要目的: 接口,觸摸屏控制器
    嵌入式:
    已用 IC / 零件: AD7879
    主要屬性: 4 線電阻式觸控屏控制器,I²C 和 SPI 接口
    次要屬性: 圖形用戶界面,USB 接口
    已供物品: 板,線纜,CD,觸控屏
    AD7879/AD7889
    Rev. C | Page 38 of 40
    OUTLINE DIMENSIONS
    120808-
    A
    B
    C
    D
    1
    2
    3
    BOTTOM VIEW
    (BALL SIDE UP)
    TOP VIEW
    (BALL SIDE DOWN)
    0.36
    0.32
    0.28
    0.17
    0.15
    0.13
    1.50
    REF
    BALL 1
    IDENTIFIER
    SEATING
    PLANE
    0.50
    REF
    0.37
    0.35
    0.33
    0.28
    0.24
    0.20
    0.10 MAX
    COPLANARITY
    1.67
    1.61
    1.55
    2.07
    2.01
    1.95
    0.65
    0.59
    0.53
    Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
    (CB-12-1)
    Dimensions shown in millimeters
    010410-A
    A
    B
    C
    D
    0.650
    0.595
    0.540
    1.555
    1.505
    1.455
    2.055
    2.005
    1.955
    1
    2
    3
    BOTTOM VIEW
    (BALL SIDE UP)
    TOP VIEW
    (BALL SIDE DOWN)
    0.340
    0.320
    0.300
    1.50
    REF
    BALL 1
    IDENTIFIER
    SEATING
    PLANE
    1.00
    REF
    0.50
    REF
    0.380
    0.355
    0.330
    0.040 MAX
    0.020 MIN
    0.270
    0.240
    0.210
    0.10 MAX
    COPLANARITY
    Figure 48. 12-Ball, Backside-Coated Wafer Level Chip Scale Package [WLCSP]
    (CB-12-5)
    Dimensions shown in millimeters
    16
    5
    13
    8
    9
    12
    1
    4
    1.95 BSC
    PIN 1
    INDICATOR
    TOP
    VIEW
    4.00
    BSC SQ
    3.75
    BSC SQ
    COPLANARITY
    0.08
    EXPOSED
    PAD
    (BOTTOM VIEW)
    COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
    12° MAX
    1.00
    0.85
    0.80
    SEATING
    PLANE
    0.35
    0.30
    0.25
    0.80 MAX
    0.65 TYP
    0.05 MAX
    0.02 NOM
    0.20 REF
    0.65 BSC
    0.60 MAX
    PIN 1
    INDICATOR
    0.50
    0.40
    0.30
    0.25 MIN
    2.50
    2.35 SQ
    2.20
    082008-
    A
    FOR PROPER CONNECTION OF
    THE EXPOSED PAD, REFER TO
    THE PIN CONFIGURATION AND
    FUNCTION DESCRIPTIONS
    SECTION OF THIS DATA SHEET.
    Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
    4 mm × 4 mm, Very Thin Quad
    (CP-16-10)
    Dimensions shown in millimeters
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