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參數(shù)資料
| 型號： | EVAL-ADCMP609BRMZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADCMP609 8MSOP |
| 標準包裝： | 1 |
| 主要目的： | 比較器，單路 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADCMP609 |
| 主要屬性： | CMOS 和 TTL 兼容輸出 |
| 次要屬性： | 關(guān)機引腳 |
| 已供物品： | 板 |
ADCMP609
Rev. A | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltages
Supply Voltage (VCC to Ground)
0.5 V to +6.0 V
Supply Differential
6.0 V to +6.0 V
Input Voltages
Input Voltage
0.5 V to VCC + 0.5 V
Differential Input Voltage
±(VCC + 0.5 V)
Maximum Input/Output Current
±50 mA
Shutdown Pin
Applied Voltage (SDN to Ground)
0.5 V to VCC + 0.5 V
Maximum Input/Output Current
±50 mA
Hysteresis Control Pin
Applied Voltage (HYS to Ground)
0.5 V to VCC + 0.5 V
Maximum Input/Output Current
±50 mA
Output Current
±50 mA
Operating Temperature
Ambient Temperature Range
40°C to +125°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3.
Package Type
θJA1
Unit
ADCMP609 8-Lead MSOP
130
°C/W
1 Measurement in still air.
ESD CAUTION
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