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參數(shù)資料
| 型號： | EVAL-ADG884EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR ADG884 |
| 標準包裝： | 1 |
| 系列： | * |
Data Sheet
ADG884
Rev. D | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VDD
S1A
D1
IN1
S1B
S2A
NOTES
1. THE LFCSP_WD PACKAGE HAS AN
EXPOSED PAD THAT SHOULD BE TIED
TO GROUND.
D2
IN2
S2B
GND
0
502
8-
00
2
1
2
3
4
5
10
9
8
7
6
ADG884
TOP VIEW
(Not to Scale)
Figure 2. LFCSP_WD and MSOP Pin Configuration
(SOLDER BALLS ON OPPOSITE SIDE)
S1B
GND
IN1
D1
1
9
2
10
S1A
VDD
87
S2B
IN2
D2
3
4
5
S2A
6
ADG884
TOP VIEW
(Not to Scale)
12
3
A
B
C
D
050
28
-02
8
Figure 3. WLCSP Pin Configuration
Table 5. LFCSP_WD and MSOP Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VDD
Most Positive Power Supply Potential.
2
S1A
Source Terminal. Can be an input or output.
3
D1
Drain Terminal. Can be an input or output.
4
IN1
Logic Control Input.
5
S1B
Source Terminal. Can be an input or output.
6
GND
Ground (0 V) Reference.
7
S2B
Source Terminal. Can be an input or output.
8
IN2
Login Control Input.
9
D2
Drain Terminal. Can be an input or output.
10
S2A
Source Terminal. Can be an input or output.
EPAD
The LFCSP_WD package has an exposed pad that should be tied to ground.
Table 6. WLCSP Package Pin Function Description
WLCSP Package
Ball Number
Location
Mnemonic
Description
1
A1
S1B
Source Terminal. Can be an input or output.
2
A2
GND
Ground (0 V) Reference.
3
A3
S2B
Source Terminal. Can be an input or output.
4
B3
IN2
Login Control Input.
5
C3
D2
Drain Terminal. Can be an input or output.
6
D3
S2A
Source Terminal. Can be an input or output.
7
D2
VDD
Most Positive Power Supply Potential.
8
D1
S1A
Source Terminal. Can be an input or output.
9
C1
D1
Drain Terminal. Can be an input or output.
10
B1
IN1
Logic Control Input.
Table 7. ADG884 Truth Table
Logic (IN1/IN2)
Switch 1A/Switch 2A
Switch 1B/Switch 2B
0
Off
On
1
On
Off
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