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參數(shù)資料
| 型號： | HMMC-5618 |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.0326 X 0.0326 INCH, DIE |
| 文件頁數(shù)： | 6/8頁 |
| 文件大?。?/td> | 175K |
| 代理商： | HMMC-5618 |
6
Figure 11.
Bonding Pad Positions
(Dimensions are in micrometers)
0
145
355
573
0
530
920
0
920
79
593
RF INPUT
RF OUT
Gold Plated Shim
(100 pF)
(Optional)
To VG1 Power
To VG2 Power
Supply
Chip Capacitor
Bonding Island
RF INPUT
RF OUT
Gold Plated Shim
To VDD Power Supply
(100 pF)
(Optional)
Chip Capacitor
Figure 10.
Assembly Diagrams
(a) Assembly for single drain–bias operation.
(b) Assembly with gate bias connections.
or Small
Chip-Capacitor
Locate near MMIC
VG1
VG2
VD1
VD2
IN
OUT
800 pF
Short Bond Wires
.2nH Bond Wire Inductance (10 mils)
.2nH Bond Wire
Inductance (10 mils)
To VDD Power Supply
相關PDF資料 |
PDF描述 |
|---|---|
| HMMC-5618 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMR223.3G | 240 MHz MOBILE STATION ANTENNA, 5.1 dBi GAIN |
| HMU-PAT-FH-K103 | RF/MICROWAVE FIXED ATTENUATOR |
| HMU-PAT-FH-K109 | RF/MICROWAVE FIXED ATTENUATOR |
| HMU-PAT-FH-K110 | RF/MICROWAVE FIXED ATTENUATOR |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HMMC-5620 | 制造商:Agilent Technologies 功能描述:RF AMP MOD SGL GAIN AMP 20GHZ 7.5V - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMD47 | 制造商:SPRAGUE 功能描述:CAPACITOR SPRAGUE |
| HMM-HH | 制造商:Cooper Bussmann 功能描述: |
| HMMXS10 | 制造商:Sprague/Vishay 功能描述:CD310X0075 |
| HMN12816D | 制造商:HANBIT 制造商全稱:Hanbit Electronics Co.,Ltd 功能描述:Non-Volatile SRAM MODULE 2Mbit (128K x 16-Bit), 40pin-Dip, 5V |
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