參數(shù)資料
型號: HTCM400
廠商: NXP Semiconductors N.V.
英文描述: HITAG core module hardware
中文描述: 此外,HITAG核心模塊的硬件
文件頁數(shù): 12/24頁
文件大?。?/td> 112K
代理商: HTCM400
2001 Oct 04
12
Philips Semiconductors
Product specification
HITAG core module hardware
HTCM400
9
MECHANICAL SPECIFICATIONS
The module consists of the Printed-Circuit Board (PCB)
and one 14-pole and one 13-pole pin connector that
protrudes from the PCB.
9.1
Mounting the module
You can mount the module onto a base printed-circuit
board by soldering or plugging.
9.2
Dimensions
The outer dimensions of the PCB are: 86
×
40
×
7 mm.
The module including the pin connectors is approximately
18 mm high.
handbook, full pagewidth
MGW325
60.0
32.0
4.0
26.3
13.0
26.7
40.0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
27
26
25
24
23
22
21
20
19
18
17
16
15
86.0
25.4
7.3
40
18
2.54
0.64
Fig.8 Dimensions (seen from below the module) and pins protruding.
Dimensions are in mm.
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