參數(shù)資料
型號(hào): HTCM400
廠商: NXP Semiconductors N.V.
英文描述: HITAG core module hardware
中文描述: 此外,HITAG核心模塊的硬件
文件頁數(shù): 8/24頁
文件大小: 112K
代理商: HTCM400
2001 Oct 04
8
Philips Semiconductors
Product specification
HITAG core module hardware
HTCM400
7.4
Postal approval
The postal approval can only be granted for final products,
not just for components like the HTCM400. But the core
module is designed in a way that it is possible to get the
postal approval for a device including the HTCM400, if you
follow the design instructions given by Philips.
Electromagnetic emission comply with the guidelines in
FTZ 17 TR 2100 and ETS 300 683. Electromagnetic
immunity complies with the guidelines in ETS 300 683.
7.4.1
C
OMMON MODE FILTERING
Figure 5 shows the basic configuration using the
HTCM400 used to comply with the standards and some
additional circuits which are recommended.
handbook, full pagewidth
MGW326
1 nF
DVDD,
AVDD
DGND,
AGND
1 nF
ANTENNA
RS232-
interface
power
supply
5 V DC
100
nF
(1)
(1)
1 nF
1 nF
TxD
RxD
GND
1 nF
1 nF
TX1
RX
AGND
HTCM400
1 nF
Fig.5 Common mode filtering.
(1) SMD filter Murata NFM61R10T102.
The design consists of a virtual ground layer (drawn grey
in Fig.5). All entering wires are blocked by 1 nF ceramic
capacitors to this layer to prevent common mode
disturbances from entering the following circuits. The
virtual ground layer is floating, it is not connected to the
ground itself.
A recommended metal housing that covers the HTCM400
would also be connected to the floating layer.
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