參數(shù)資料
型號(hào): HTCM400
廠商: NXP Semiconductors N.V.
英文描述: HITAG core module hardware
中文描述: 此外,HITAG核心模塊的硬件
文件頁數(shù): 13/24頁
文件大?。?/td> 112K
代理商: HTCM400
2001 Oct 04
13
Philips Semiconductors
Product specification
HITAG core module hardware
HTCM400
10 APPLICATION INFORMATION
10.1
Metallic environment, interferences
The communication range is impaired by metallic
environment and electromagnetic interferences (e.g.
monitors and keyboards). Therefore, you should keep a
distance of at least the antenna’s diameter to metallic
surfaces or loops as well as to electromagnetic
interferences. If this is not possible, you have to take
preventive measures such as using ferrites for
transponders and antennas or shielding for antennas.
10.2
Distance between two antennas
In order to be able to operate two systems side by side
without negative influence on communication ranges, you
must place the antennas at a minimum distance of four
times the antenna diameter. If you place them at a closer
distance be sure to use suitable shielding or
synchronization.
10.3
To build a proximity reader
10.3.1
C
ONNECTION OF THE
HTCM400
IN ORDER TO BUILD A PROXIMITY READ AND WRITE DEVICE
.
A few external components are needed to make the HTCM400 a proximity read and write device (see Fig.10).
handbook, full pagewidth
MGW330
serial interface
other 125 kHz
transponders
HITAG
CORE MODULE
HTCM400
antenna
tags
Fig.9 Block diagram of proximity reader module.
handbook, full pagewidth
MGW333
CORE MODULE
HTCM400
POWER
SUPPLY
filter on/off switch
(optional)
DVDD
AVDD
DGND
RxD
TxD
TXDEN
TX1
RX
AGND
AGND
OUT1
OUT2
IN1
IN2
SERIAL
INTERFACE
DRIVER
(if needed)
I/O FUNCTIONS
(if needed)
ANTENNA
COUPLING
Fig.10 Building a proximity read/write device.
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