參數(shù)資料
型號: IBM25EMPPC750DBUB2660
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 21/44頁
文件大?。?/td> 514K
代理商: IBM25EMPPC750DBUB2660
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
28 of 44
7.0 PPC740 and PPC750 Microprocessor Package Description
The following sections provide the package parameters and the mechanical dimensions
for the PPC740 and PPC750.
7.1 Parameters for the 255 CBGA Package (PPC740)
The package parameters are as provided in the following list. The package type is 21 x
21 mm, 255-lead ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
Note: The PPC740 (255 CBGA) package offering is subject to availability - see your IBM
marketing representative.
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