參數(shù)資料
型號: IBM25EMPPC750DBUB2660
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 35/44頁
文件大?。?/td> 514K
代理商: IBM25EMPPC750DBUB2660
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
40 of 44
Figure 21. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements. There are sev-
eral commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Specic
Thermal
Resistance
(Kin
2
/W)
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
+
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
+
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