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參數(shù)資料
| 型號(hào)： | ICS83PR226BKI-01LFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 9/23頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SYNTHESIZER PROGR 10-VFQFPN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | HiPerClockS™, FemtoClock™ |
| 類型： | 時(shí)鐘/頻率合成器 |
| PLL： | 是 |
| 輸入： | 晶體 |
| 輸出： | LVPECL |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:1 |
| 差分 - 輸入:輸出： | 無/是 |
| 頻率 - 最大： | 213.33MHz |
| 除法器/乘法器： | 是/無 |
| 電源電壓： | 2.375 V ~ 3.465 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-VQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 10-VFQFPN（5x7） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 83PR226BKI-01LFT |
ICS83PR226BKI-01 REVISION B AUGUST 10, 2010
17
2010 Integrated Device Technology, Inc.
ICS83PR226I-01 Data Sheet
PROGRAMMABLE FEMTOCLOCK LVPECL OSCILLATOR REPLACEMENT
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS83PR226I-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS83PR226I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 172mA = 595.98mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.465V, with all outputs switching) = 595.98mW + 30mW = 625.98mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 38.05°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.626W * 38.05°C/W = 108.8°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board.
Table 7. Thermal Resistance θJA for 10 Lead VFQFN, Forced Convection
θ
JA vs. Air Flow
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
38.05°C/W
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