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| 型號： | intel Pentium CPU |
| 廠商： | Intel Corp. |
| 英文描述： | 32 Bit CPU With MMX Technology and Mobile Module(32位帶MMX和移動模塊處理器) |
| 中文描述： | 32位CPU的MMX技術(shù)和移動模塊（32位帶MMX公司和移動模塊處理器） |
| 文件頁數(shù)： | 27/36頁 |
| 文件大小： | 395K |
| 代理商： | INTEL PENTIUM CPU |
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INTEL PENTIUM PROCESSOR WITH MMX TECHNOLOGY MOBILE MODULE
27
1/8/98 4:35 PM 24351502.DOC
3.6.
Thermal Transfer Plate
The Intel Mobile Module provides a thermal
transfer plate connected to the processor in a
standard position called the thermal attach point.
The thermal attach point is a fixed location relative
to the mounting holes and other physical datum on
the Intel Mobile Module. The system manufacturer
can use both a heat pipe and a heat spreader plate
in contact with the thermal attach point to transfer
heat through the notebook system.
The thermal transfer plate is physically mounted to
the Intel Mobile Module, and may be different from
one generation of Intel Mobile Module to the next.
However, the thermal attach point will remain fixed
across future generations of Intel Mobile Modules.
Figure 5
shows
the
between the circuit board, thermal transfer plate
and thermal attach point.
conceptual
relationship
3.7.
Module Thermal Resistance
Intel has completed extensive thermal testing of
the module in a variety of environments to
determine the overall thermal resistance between
the CPU TCP packaging and the top of the TTP.
The worst case thermal resistance guaranteed by
Intel is 2.5° C/W though typically this resistance
will be less. System OEMs should take this under
consideration when designing system thermal
solutions.
4.0.
MECHANICAL
REQUIREMENTS
4.1.
Module Dimensions
This section provides the physical dimensions for
the Intel Mobile Module.
4.1.1.
BOARD AREA
Figure 6 shows the board dimensions and the
connector orientation for the Intel Mobile Module .
These dimensions are necessary to accommodate
the next generation of Intel mobile processor and
PCI Northbridge chipset controller.
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