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參數(shù)資料
| 型號： | IRFU2407 |
| 廠商： | International Rectifier |
| 英文描述： | Power MOSFET(Vdss=75V, Rds(on)=0.026ohm, Id=42A) |
| 中文描述： | 功率MOSFET（減振鋼板基本\u003d 75V的，的Rds（on）\u003d 0.026ohm，身份證\u003d 42A條） |
| 文件頁數(shù)： | 1/10頁 |
| 文件大?。?/td> | 129K |
| 代理商： | IRFU2407 |
IRFR2407
IRFU2407
HEXFET
Power MOSFET
Seventh Generation HEXFET
Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-
hole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
Absolute Maximum Ratings
S
D
G
Parameter
Max.
42
29
170
110
0.71
± 20
130
25
11
5.0
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
A
W
W/°C
V
mJ
A
mJ
V/ns
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 175
300 (1.6mm from case )
10 lbfin (1.1Nm)
°C
V
DSS
= 75V
R
DS(on)
= 0.026
I
D
= 42A
Description
3/1/00
www.irf.com
1
l
Surface Mount (IRFR2407)
l
Straight Lead (IRFU2407)
l
Advanced Process Technology
l
Dynamic dv/dt Rating
l
Fast Switching
l
Fully Avalanche Rated
PD -93862
D-Pak I-Pak
IRFR2407 IRFU2407
Parameter
Typ.
–––
–––
–––
Max.
1.4
50
110
Units
R
θ
JC
R
θ
JA
R
θ
JA
* When mounted on 1" square PCB (FR-4 or G-10 Material) .
For recommended footprint and soldering techniques refer to application note #AN-994
Junction-to-Case
Junction-to-Ambient (PCB mount)*
Junction-to-Ambient
°C/W
Thermal Resistance
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