參數(shù)資料
型號: IRLML5103
廠商: International Rectifier
英文描述: HEXFET Power MOSFET(HEXFET 功率MOS場效應(yīng)管)
中文描述: HEXFET功率MOSFET(馬鞍山的HEXFET功率場效應(yīng)管)
文件頁數(shù): 1/8頁
文件大?。?/td> 107K
代理商: IRLML5103
PD - 9.1260D
HEXFET
Power MOSFET
V
DSS
= -30V
R
DS(on)
= 0.60
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
A customized leadframe has been incorporated into the
standard SOT-23 package to produce a HEXFET Power
MOSFET with the industry's smallest footprint. This
package, dubbed the Micro3, is ideal for applications
where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro3 allows it to fit easily into
extremely thin application environments such as portable
electronics and PCMCIA cards.
IRLML5103
8/25/97
Description
l
Generation V Technology
l
Ultra Low On-Resistance
l
P-Channel MOSFET
l
SOT-23 Footprint
l
Low Profile (<1.1mm)
l
Available in Tape and Reel
l
Fast Switching
S
D
G
Micro3
Parameter
Max.
-0.76
-0.61
-4.8
540
4.3
± 20
-5.0
-55 to + 150
Units
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
A
mW
mW/°C
V
V/ns
°C
V
GS
dv/dt
T
J,
T
STG
Absolute Maximum Ratings
Parameter
Typ.
–––
Max.
230
Units
°C/W
R
θ
JA
Maximum Junction-to-Ambient
Thermal Resistance
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