28 FN6668.9 June 20, 2012 Revision History The revision history provided is for informational purposes only and is believed to be acc" />
參數(shù)資料
型號: ISL12022MIBZ-T
廠商: Intersil
文件頁數(shù): 21/31頁
文件大?。?/td> 0K
描述: IC RTC/CALENDAR TEMP SENS 20SOIC
應(yīng)用說明: Addressing Power Issues in Real Time Clock Appls
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1
類型: 時鐘/日歷
特點(diǎn): 警報(bào)器,夏令時,閏年,SRAM
存儲容量: 128B
時間格式: HH:MM:SS(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 5.5 V
電壓 - 電源,電池: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ISL12022MIBZ-TDKR
ISL12022M
28
FN6668.9
June 20, 2012
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
May 15, 2012
FN6668.9 “Absolute Maximum Ratings” on page 5, Latch-up. Changed from:
Latch-up. . . . . . . . . . . . . .Class II Level A , passed at +85°C ambient with the
Level A latch-up criteria of 100mA or 1.5*VMAX input
To
Latch-up (Tested per JESD-78B, Class 2, Level A. . . . . . 100mA
Added new section header “OSCILLATOR ACCURACY” on page 6
Removed Min/Max of -5/5ppm for “Oscillator Stability vs Temperature” on page 6. Added typ of ±2ppm
Changed Min/Max for “Oscillator Initial Accuracy” on page 6 from -3/+3 ppm to -2/+8ppm
Added notes 17, 18 cross references where required to above specs.
Added notes 17, 18 and 19 to end of spec table on page 7.
“Layout Considerations” on page 26. Changed 1st sentence of 2nd paragraph from:
"The part of the package that has NC pins from pin 1 to 5 and from pin 16 to 20 contains the crystal." to "The part of
the package from pin 1 to 5 and from pin 16 to 20 contains the crystal."
October 31, 2011
FN6668.8 Converted to newest datasheet template.
Description, 1st paragraph, added “Backup battery current draw is less than 1.6A over the temperature range.”
Features: added bullet “1.6A Max Battery Current”
“Pin Descriptions” on page 2; added Ground pin row and separated Vdd pin.
Ordering Information table - Updated Tape & Reel note in Ordering Information to new standard "Add "-T*" suffix for
tape and reel." The "*" covers all possible tape and reel options.
IDD1 at 5V/3V limits changed from: 7/6A to: 15/14A
Power-Down Timing, added Vddsr+ as typical, with note 16.
Added note 16 for Vddsr+: "To avoid EEPROM recall issues, it is advised to use this minimum power up slew rate. Not
tested, shown as typical only."
“Oscillator Compensation” on page 12, text deleted: "These values can be overwritten by the user although this is not
suggested as the resulting temperature compensation performance will be compromised."
“Oscillator fail bit (OSCF)” on page 14: changed text from: "Oscillator Fail Bit indicates that the oscillator has
stopped." to: "Oscillator Fail Bit indicates that the oscillator has failed. The oscillator frequency is either zero or very
far from the desired 32.768kHz due to failure, PC board contamination or mechanical issues."
DSTADJ bit, removed: "DSTADJ can be set to "1" for instances where the RTC device is initialized during the DST
Forward period." Added: "It is read-only and cannot be written. Setting time during a DST forward period will not set
this bit to "1"."
Table 19 on page 20, FDTR changed from <2:0> to <4:0>
Updated “Package Outline Drawing” on page 31 from rev 2 to rev 3, due to the following changes: Top View: Corrected
"7.50 BSC" to "7.60/7.40" (no change from rev 2; error was introduced in conversion)
Changed "10.30 BSC" to "10.65/10.00" (no change from rev 2; error was introduced in conversion)
Side View: Changed "12.80 BSC" to "13.00/12.60" (no change from rev 2; error was introduced in conversion)
Changed "2.65 max" to "2.65/2.35" (no change from rev 2; error was introduced in conversion)
Changed Note 1 from "ANSI Y14.5M-1982." to "ASME Y14.5M-1994"
Updated to new POD format by moving dimensions from table onto drawing and adding land pattern
May 27, 2010
FN6668.7 Added CDM to “ESD Rating” on page 5
January 20, 2010
FN6668.6 Updated Note 2 in Ordering Information table from “These Intersil Pb-free plastic packaged products employ special Pb-
free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.” to “These Intersil plastic packaged products employ special material sets, molding compounds and 100% matte tin
plate plus anneal (e3) termination finish. These products do contain Pb but they are RoHS compliant by exemption 7 (lead
in high melt temp solder for internal connections) and exemption 5 (lead in piezoelectric elements). These Intersil RoHS
compliant products are compatible with both SnPb and Pb-free soldering operations. These Intersil RoHS compliant
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.”
Changed "Pb-Free" on page 1 and page 3 Ordering Information: "RoHS Compliant"
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