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參數(shù)資料
| 型號： | ISL96017UIRT8Z-TK |
| 廠商： | Intersil |
| 文件頁數(shù)： | 7/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP 128-TAP 50KOHM 8-TDFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 接片： | 128 |
| 電阻（歐姆）： | 50k |
| 電路數(shù)： | 1 |
| 溫度系數(shù)： | 標(biāo)準(zhǔn)值 ±100 ppm/°C |
| 存儲(chǔ)器類型： | 非易失 |
| 接口： | I²C |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 8-TDFN（3x3） |
| 包裝： | 帶卷 (TR) |
ISL96017
3
FN8243.2
June 8, 2012
Absolute Maximum Ratings
Thermal Information
Storage Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Note: All Voltages with Respect to GND
Voltage at SCL, SDA, WP: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4V
Voltage at RH, RW, RL: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VDD
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 4V
Lead Temperature (Soldering, 10s): . . . . . . . . . . . . . . . . . . . . . . . . . .300°C
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
ESD (MIL-STD-883B, Method 3014). . . . . . . . . . . . . . . . . . . . . . . . . .>2000V
ESD (Machine Model). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >150V
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
8 Ld TDFN Package (Notes 3, 4). . . . . . . . .
52
5
Moisture Sensitivity (see Technical Brief TB363). . . . . . . . . .Level 2
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . .150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
VDD Voltage for DCP Operation . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 3.6V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3mA to 3mA
Power Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mW
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTE:
3.
θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379 for details.
4. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Over recommended operating conditions unless otherwise stated. All voltages with respect to GND. Boldface
limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 18)
TYP
(Note 5)
MAX
(Note 18)
UNIT
IccdSby
Standby Current at VDD
Serial interface in standby
10
A
IccdRd
Read Current at VDD
Reading with 400kHz at SCL
1
mA
IccdWr
Write Current at VDD
Writing to EEPROM
5
mA
ILkgDig
Leakage Current at Pins SDA, SCL, and WP
Pin voltage from GND to VDD
-10
10
A
ILkgDCP
Leakage Current at RH, RW, RL
Pin voltage from GND to VDD
-1
1
A
VDDRamp
VDD Power-Up Ramp Rate
0.2
V/ms
tDCP
(Note 17)
DCP Wiper Response Time
SCL falling edge of last bit of DCP Data Byte to
wiper change
1.5
s
tD
Power-Up Delay
VDD above 2.6V, to DCP Initial Value Register
recall completed, and I2C Interface in standby
state
3
ms
CH/CW/CL
(Note 17)
RH, RW, RL Pin Capacitance
10
pF
RTotal
Total Resistance
W and U versions, respectively. TA = 25°C.
Measured between RH and RL pins.
10, 50
k
Ω
RTotal Tolerance
TA = 25°C. Measured between RH and RL
pins.
-20
20
%
RWiper
Wiper Resistance
VDD = 3.3V @ 25°C. Wiper current =
VDD/RTotal
100
300
Ω
DCP Resolution
7
Bits
DCP IN VOLTAGE DIVIDER MODE (0V at RL, VCC at RH; measured at RW unloaded)
FSerror
(Note 6, 7)
Full-Scale Error
U option
-2
-1
0
LSB
W option
-5
-1
0
LSB
ZSerror
(Note 6, 8)
Zero-Scale Error
U option
0
1
2
LSB
W option
0
1
5
LSB
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