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2
IXLD02SI
Absolute Maximum Ratings
(Note 1)
Name
VDD
Definition
Min
-0.4
Typ
Max
5.5
Units
V
Test Conditions
Logic supply input voltage
VDDA
Analog bias supply input voltage
-0.4
5.5
V
VTT
IBI
V
IBI
Internal bias voltage input
Internal bias current input
Applied IBI terminal voltage
Pulse width programming
current input
Applied IPW terminal voltage
Output current programming
input
Applied IOP terminal voltage
-0.4
-10
-0.4
VDDA/2
0.1
VDDA+.5
10
VDDin+0.5
V
mA
V
IPW
-10
0.1
10
mA
V
IPW
-0.4
VDDin+0.5
V
IOP
-10
1
10
mA
V
IOP
V
PDN
V
RST
V
FIN
V
OUT
V
OUT
-0.4
VDDin+0.5
V
Power-down logic input
-0.4
VDDin+0.5
V
Reset logic input
-0.4
VDDin+0.5
V
Pulse frequency logic input
-0.4
VDDin+0.5
V
Pulse current true output
-0.1
3
Amps
OUT terminal voltage
Pulse current complement
output
OUTB terminal voltage
-0.4
9
V
OUTB
-0.1
3
Amps
V
OUTB
-0.4
9
V
T
C
Device Case Temperature
-40
25
85
o
C
Measured at the
bottom of the
SO28 package
heat slug insert.
SO28 package
heat slug insert
held at T
C
=85
o
C.
P
D
Package power dissipation @
T
C
=85C
32
Watts
R
THJC
Thermal resistance, junction to
case
Junction Temperature
2
o
C/W
T
J
T
S
150
o
C
Storage temperature
Lead temperature (soldering, 10
sec)
-55
150
o
C
T
L
300
o
C
Note 1:
Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures
when handling and assembling this component.
Ordering Information
Part Number Package Type Temp. Range
IXLD02SI
28-Pin SOIC
Grade
-40
°
C to +85
°
C Industrial