
Page 16
Direct RDRAM
K4R271669F
Version 1.41 Jan. 2004
Absolute Maximum Rating
Note*) Refer to T
J,
Θ
JC
I
DD
- Supply Current Profile
Table 14: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
V
I,ABS
Voltage applied to any RSL or CMOS pin with respect to Gnd
- 0.3
V
DD
+0.3
V
V
DD,ABS
, V
DDA,ABS
Voltage on VDD and VDDA with respect to Gnd
- 0.5
V
DD
+1.0
V
T
STORE
Storage temperature
- 50
100
°
C
T
MIN
Minimum operation temperature
0
Note*
°
C
Table 15: Supply Current Profile
I
DD
value
RDRAM Power State and Steady-State Transaction Rates
a
Min
Max
-45
-800
Unit
I
DD,PDN
Device in PDN, self-refresh enabled and INIT.LSR=0.
-
5000
μ
A
I
DD,NAP
Device in NAP.
-
4
mA
I
DD,STBY
Device in STBY. This is the average for a device in STBY with (1) no packets on the Chan-
nel, and (2) with packets sent to other devices.
-
75
mA
I
DD,REFRESH
Device in STBY and refreshing rows at the t
REF,MAX
period.
-
75
mA
I
DD,ATTN
Device in ATTN. This is the average for a device in ATTN with (1) no packets on the Chan-
nel, and (2) with packets sent to other devices.
-
115
mA
I
DD,ATTN-W
Device in ATTN. ACT command every 8t
CYCLE
, PRE command every 8
t
CYCLE
, WR
command every 4
t
CYCLE
, and data is 1100..1100
-
500
mA
I
DD,ATTN-R
Device in ATTN. ACT command every 8t
Cb
, PRE command every 8
t
CYCLE
, RD com-
mand every 4
t
CYCLE
, and data is 1111..1111
-
480
mA
a. CMOS interface consumes power in all power states.
b. This does not include the I
OL
sink current. The RDRAM device dissipates I
OL
V
OL
in each output driver when a logic one is driven.
Table 16: Supply Current at Initialization
Symbol
Parameter
Allowed Range of t
CYCLE
V
DD
Min
Max
Unit
I
DD,PWRUP,D
I
DD
from power -on to SETR
3.33ns to 3.83ns
2.50ns to 3.32ns
V
DD,MIN
-
150
a
200
mA
I
DD,SETR,D
I
DD
from SETR to CLRR
3.33ns to 3.83ns
2.50ns to 3.32ns
V
DD,MIN
-
250
332
mA
a. The supply current will be 150mA when t
CYCLE
is in the range 15ns to 1000ns.