參數(shù)資料
型號: KAD5514P-12Q72
廠商: Intersil
文件頁數(shù): 26/34頁
文件大?。?/td> 0K
描述: IC ADC 14BIT 125MSPS SGL 72-QFN
產(chǎn)品培訓(xùn)模塊: High-Speed Analog-to-Digital Converters
標(biāo)準(zhǔn)包裝: 1
系列: FemtoCharge™
位數(shù): 14
采樣率(每秒): 125M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 376mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 72-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 72-QFN(10x10)
包裝: 托盤
輸入數(shù)目和類型: 1 個差分,單極
32
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reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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FN6804.2
September 10, 2009
Revision History
DATE
REVISION
CHANGE
7/30/08
Rev 0a
Preliminary Datasheet Update
10/23/08
FN6804.0
Converted to intersil template. Assigned file number FN6804. Rev 0 - first release (as preliminary datasheet) with new
file number.
11/13/08
FN6804.0
Applied Intersil Standards
1/15/09
FN6804.0
P1; revised Key Specs
P2; added Part Marking column to Order Info
P4; moved Thermal Resistance to Thermal Info table and added Theta JA note 3 per packaging
P4-8; revisions throughout spec tables. Added notes 9 and 10 to Switching Specs.
P9; revised function for Pin 22 OUTMODE, Pin 23 NAPSLP and Pin 16 CLKDIV
P11; revised function for Pin 16 NAPSLP
P13-15; Added Typical Performance curves
P17; added Figs 25-26
P17; User Initiated Reset - revised 2nd sentence of 1st paragraph
P18; Serial Peripheral Interface- 1st paragraph; revised 4th sentence
P19; revised Nap/Sleep; revised 3rd sentence of 1st paragraph
P21; Serial Peripheral Interface- added 3rd sentence to 4th paragraph
P23; Address 0x24: Gain_Fine; added 2 sentences to end of 1st paragraph.
Revised Table 8
P24; removed Figure (PHASE SLIP: CLK÷2 MODE, fCLOCK = 500MHz)
Address 0x71: Phase_slip; added sentence to end of paragraph
P27; Changed AVDD to OVDD in Fig 46
P27; revised Fig 45
P27; Table 16; revised Bits7:4, Addr C0
Throughout; formatted graphics to Intersil standards
2/25/09
FN6804.1
Corrected 48 QFN pin description table on page 11 to show OVDD pins from “20, 27” to “20, 37”.
Changed “odd” bits N in Figure 1A - DDR to “even” bits N, Replaced POD L48.7x7E due to changed dimension from
“9.80 sq” to “6.80” sq. in land pattern
8/17/09
FN6804.2
1) Added nap mode, sleep mode wake up times to spec table
2) Added CSB,SCLK Setup time specs for nap, sleep modes
3) Added section showing 72pin/48pin package feature differences and default state for clkdiv,outmode,outfmt page 30
4) Changed SPI setup time specs wording in spec table
5) Added ‘Reserved’ to SPI memory map at address 25H
6) Renumbered Notes
7) Added test platform link on page 30
8) Added ddr enable note13 for 48 pin/72 pin options
9) Changed pin description table for 72/48 pin option, added DDR notes
10) changed multi device note in spi physical interface section to show 3-wire application.page 23
11) Update digital output section for ddr operation page 20
12) change to fig25and fig26 and description in text
13) Added connect note for thermal pad
14) Formatted Figures 25 and 26 with Intersil Standards,
15) Change to SPI interface section in spec table, timing in cycles now, added write, read specific timing specs.
16) Updated SPI timing diagrams, Figures 37, 38
17) Updated wakeup time description in “Nap/Sleep” on page 21.
18) Removed calibration note in spec table
19) Changed label in fig 46
20) Updated cal paragraph in user initiated reset section per DC.
8/24/09
FN6804.2
1) Changed tDHR spec needs from 1.5 to 3 cycles.
2) Moved 20k ohm label in fig 46 closer to resistor connected to ovdd
KAD5514P
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