參數(shù)資料
型號: KFG1216Q2M-DED
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: FLASH MEMORY
中文描述: 閃存
文件頁數(shù): 41/93頁
文件大?。?/td> 1219K
代理商: KFG1216Q2M-DED
OneNAND512/OneNAND1GDDP
FLASH MEMORY
41
Figure 5. Cold Reset Timings
Note: 1) Bootcode copy operation starts 400us later than POR activation.
The system power should reach Vcc after POR triggering level(typ. 1.5V) within 400us for valid boot code data.
2) 1K bytes Bootcode copy takes 70us(estimated) from sector0 and sector1/page0/block0 of NAND Flash array to BootRAM.
Host can read Bootcode in BootRAM(1K bytes) after Bootcode copy completion.
3) INT register goes ‘Low’ to ‘High’ on the condition of ‘Bootcode-copy done’ and RP rising edge.
If RP goes ‘Low’ to ‘High’ before ‘Bootcode-copy done’, INT register goes to ‘Low’ to ‘High’ as soon as ‘Bootcode-copy done’
Reset Mode
Cold Reset
At system power-up, the voltage detector in the device detects the rising edge of Vcc and releases internal power-up reset signal
which triggers bootcode loading. Bootcode loading means that the boot loader in the device copies designated sized data(1KB) from
the beginning of memory to the BootRAM.
System Power
Sleep
Bootcode copy
Idle
Bootcode - copy done
POR triggering level
3)
2)
RP
INT
OneNAND
Operation
0 (default)
1
IOBE bit
1 (default)
INTpol bit
High-Z
1)
INT bit
0 (default)
1
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