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參數(shù)資料
| 型號： | LD6806F |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Ultra low-dropout regulator, low noise, 200 mA |
| 封裝： | LD6806CX4/12P<NAX000|<<<1<Always Pb-free,;LD6806CX4/14<NAX000|<<<1<Always Pb-free,;LD6806CX4/36P<NAX000|<<<1<Always Pb-free,;LD6806CX4/23H<NAX000|<&l |
| 文件頁數(shù)： | 20/31頁 |
| 文件大?。?/td> | 1936K |
| 代理商： | LD6806F |
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LD6806_SER
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 24 August 2011
20 of 31
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package”
and in application note
AN10365 “Surface
mount reflow soldering description”
.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 35
) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
Table 12
.
Table 12.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 35
.
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LD6806F/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, SOT886 |
| LD6806F/12H,115 | 功能描述:低壓差穩(wěn)壓器 - LDO LD6806 ULTRA LOW-DO VOLT REG 200MA RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 6SOT886 |
| LD6806F/12P,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/13H | 制造商:NXP Semiconductors 功能描述:Bulk 制造商:NXP Semiconductors 功能描述:LDO 1.3V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.3V, SOT886 制造商:NXP Semiconductors 功能描述:LDO Regulator Pos 1.3V 0.2A 6-Pin XSON |
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