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參數(shù)資料
| 型號： | LD6806F |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Ultra low-dropout regulator, low noise, 200 mA |
| 封裝： | LD6806CX4/12P<NAX000|<<<1<Always Pb-free,;LD6806CX4/14<NAX000|<<<1<Always Pb-free,;LD6806CX4/36P<NAX000|<<<1<Always Pb-free,;LD6806CX4/23H<NAX000|<&l |
| 文件頁數(shù)： | 23/31頁 |
| 文件大?。?/td> | 1936K |
| 代理商： | LD6806F |
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LD6806_SER
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 24 August 2011
23 of 31
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 36
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13
and
14
Table 13.
Package thickness (mm)
Table 14.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LD6806F/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, SOT886 |
| LD6806F/12H,115 | 功能描述:低壓差穩(wěn)壓器 - LDO LD6806 ULTRA LOW-DO VOLT REG 200MA RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 6SOT886 |
| LD6806F/12P,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動(dòng)電壓（最大值）:307 mV 輸出電流:1 A 負(fù)載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/13H | 制造商:NXP Semiconductors 功能描述:Bulk 制造商:NXP Semiconductors 功能描述:LDO 1.3V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.3V, SOT886 制造商:NXP Semiconductors 功能描述:LDO Regulator Pos 1.3V 0.2A 6-Pin XSON |
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