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參數(shù)資料
| 型號： | LD6806F |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Ultra low-dropout regulator, low noise, 200 mA |
| 封裝： | LD6806CX4/12P<NAX000|<<<1<Always Pb-free,;LD6806CX4/14<NAX000|<<<1<Always Pb-free,;LD6806CX4/36P<NAX000|<<<1<Always Pb-free,;LD6806CX4/23H<NAX000|<&l |
| 文件頁數(shù)： | 22/31頁 |
| 文件大?。?/td> | 1936K |
| 代理商： | LD6806F |
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LD6806_SER
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 24 August 2011
22 of 31
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”
.
14.3.4
Cleaning
Cleaning can be done after reflow soldering.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LD6806F/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, SOT886 |
| LD6806F/12H,115 | 功能描述:低壓差穩(wěn)壓器 - LDO LD6806 ULTRA LOW-DO VOLT REG 200MA RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 6SOT886 |
| LD6806F/12P,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6806F/13H | 制造商:NXP Semiconductors 功能描述:Bulk 制造商:NXP Semiconductors 功能描述:LDO 1.3V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.3V, SOT886 制造商:NXP Semiconductors 功能描述:LDO Regulator Pos 1.3V 0.2A 6-Pin XSON |
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