
LD6806_SER
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NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 24 August 2011
30 of 31
continued >>
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
22. Tables
Table 1. Pin description LD6806CX4/xxx. . . . . . . . . . . . .2
Table 2. Pin description LD6806F/xxx . . . . . . . . . . . . . . .2
Table 3. Ordering information . . . . . . . . . . . . . . . . . . . . .3
Table 4. Type number and nominal output voltage . . . . .3
Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .4
Table 6. Operating conditions . . . . . . . . . . . . . . . . . . . . .4
Table 7. Thermal characteristics . . . . . . . . . . . . . . . . . . .4
Table 8. Electrical characteristics . . . . . . . . . . . . . . . . . .5
Table 9. External load capacitor. . . . . . . . . . . . . . . . . . .16
Table 10. Dimensions of LD6806CX4/xxx for package
outline WLCSP4; see
Figure 31
. . . . . . . . . . .17
Table 11. Dimensions of soldering footprint WLCSP4; see
Figure 33
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. Lead-free process (from J-STD-020C) . . . . . . 20
Table 13. SnPb eutectic process (from J-STD-020C) . . . 23
Table 14. Lead-free process (from J-STD-020C) . . . . . . 23
Table 15. Recommended PCB design parameters . . . . 24
Table 16. Assembly recommendations . . . . . . . . . . . . . . 25
Table 17. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 18. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 19. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27
23. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Pin configuration for LD6806CX4/xxx . . . . . . . . . .2
Pin configuration for LD6806F/xxx. . . . . . . . . . . . .2
Block diagram of LD6806x/xxH . . . . . . . . . . . . . . .3
Dropout as a function of temperature for
LD6806CX4/25H . . . . . . . . . . . . . . . . . . . . . . . . . .6
Dropout as a function of temperature for
LD6806F/25H . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Dropout as a function of temperature for
LD6806CX4/36H . . . . . . . . . . . . . . . . . . . . . . . . . .7
Dropout as a function of temperature for
LD6806F/36H . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Working voltage tolerance for LD6806CX4/12H . .7
Working voltage tolerance for LD6806CX4/25H . .7
Fig 10. Quiescent current for LD6806CX4/12H. . . . . . . . .8
Fig 11. Quiescent current for LD6806CX4/25H. . . . . . . . .8
Fig 12. Noise density for LD6806CX4/25H . . . . . . . . . . . .9
Fig 13. Noise density for LD6806CX4/36H . . . . . . . . . . . .9
Fig 14. Line regulation for LD6806CX4/12H . . . . . . . . . .10
Fig 15. Line regulation for LD6806F/12H. . . . . . . . . . . . .10
Fig 16. Line regulation for LD6806CX4/25H . . . . . . . . . .10
Fig 17. Line regulation for LD6806F/25H. . . . . . . . . . . . .10
Fig 18. Line regulation for LD6806CX4/36H . . . . . . . . . .11
Fig 19. Line regulation for LD6806F/36H. . . . . . . . . . . . .11
Fig 20. Load regulation for LD6806CX4/12H. . . . . . . . . .11
Fig 21. Load regulation for LD6806F/12H . . . . . . . . . . . .11
Fig 22. Load regulation for LD6806CX4/25H. . . . . . . . . .12
Fig 23. Load regulation for LD6806F/25H . . . . . . . . . . . .12
Fig 24. Load regulation for LD6806CX4/36H. . . . . . . . . .12
Fig 25. Load regulation for LD6806F/36H . . . . . . . . . . . .12
Fig 26. Start-up for LD6806CX4/23H. . . . . . . . . . . . . . . .13
Fig 27. PSRR for LD6806CX4/25H . . . . . . . . . . . . . . . .14
Fig 28. PSRR for LD6806CX4/36H . . . . . . . . . . . . . . . .14
Fig 29. Enable threshold voltage . . . . . . . . . . . . . . . . . . .15
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 30. Application diagram. . . . . . . . . . . . . . . . . . . . . . . 16
Fig 31. Package outline WLCSP4. . . . . . . . . . . . . . . . . . 17
Fig 32. Package outline SOT886 (XSON6). . . . . . . . . . . 18
Fig 33. Soldering footprint WLCSP4 . . . . . . . . . . . . . . . . 19
Fig 34. Soldering footprint SOT886 (XSON6). . . . . . . . . 19
Fig 35. Temperature profiles for large and small
components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fig 36. Temperature profiles for large and small
components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Fig 37. Pb-free solder reflow profile . . . . . . . . . . . . . . . . 25