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| 型號(hào)： | LPC2364FBD100 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 數(shù)學(xué)處理器 |
| 英文描述： | ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC |
| 封裝： | LPC2364FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,; |
| 文件頁數(shù)： | 58/69頁 |
| 文件大?。?/td> | 517K |
| 代理商： | LPC2364FBD100 |
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LPC2364_65_66_67_68
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 20 October 2011
58 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
14.3 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in
Figure 22
. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances C
X1
and C
X2
need to be connected
externally to the microcontroller.
Table 18
gives the crystal parameters that should be used. C
L
is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
L
influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in
Table 18
that belong to a specific C
L
. The value of external capacitances C
X1
and C
X2
specified in
this table are calculated from the internal parasitic capacitances and the C
L
. Parasitics
from PCB and package are not taken into account.
Table 18.
Crystal load capacitance
C
L
11 pF
13 pF
15 pF
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
x1
, C
x2
, and C
x3
in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
x1
and C
x2
should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 22. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for C
X1
/C
X2
evaluation
Recommended values for the RTC external 32 kHz oscillator C
X1
/C
X2
components
Maximum crystal series
resistance R
S
< 100 k
< 100 k
< 100 k
External load capacitors C
X1
/C
X2
18 pF, 18 pF
22 pF, 22 pF
27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1
RTCX2
CX2
CX1
32 kHz XTAL
=
CL
CP
RS
L
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| LPC2364FBD100,551 | 功能描述:ARM微控制器 - MCU ARM7 128KF/USB/ENET RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2364FBD100551 | 制造商:NXP Semiconductors 功能描述:IC 32BIT MCU 72MHZ LQFP-100 |
| LPC2364FET100 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flashnull |
| LPC2364FET100,518 | 功能描述:ARM微控制器 - MCU 16/32 bit micro RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2364HBD100 | 功能描述:ARM微控制器 - MCU 16-bit/32-bit Single-chip MC RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
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