參數(shù)資料
型號(hào): LPC2364FBD100
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC
封裝: LPC2364FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,;
文件頁(yè)數(shù): 64/69頁(yè)
文件大?。?/td> 517K
代理商: LPC2364FBD100
LPC2364_65_66_67_68
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 20 October 2011
64 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
17. Revision history
Table 20.
Document ID
Revision history
Release date
Data sheet status
Change
notice
-
Supersedes
LPC2364_65_66_67_68 v.7
Modifications:
20111020
Table 13 “Dynamic characteristics of flash”
: Added characteristics for t
er
and t
prog
.
Table 4 “Pin description”
: Updated description for USB_UP_LED.
Table 4 “Pin description”
: Added
Table note 12 “If the RTC is not used, these pins can
be left floating.”
for RTCX1 and RTCX2 pins.
Table 4 “Pin description”
: Added
Table note 8 “This pin has a built-in pull-up resistor.”
for DBGEN, TMS, TDI, TRST, and RTCK pins.
Table 4 “Pin description”
: Added
Table note 7 “This pin has no built-in pull-up and no
built-in pull-down resistor.”
for TCK and TDO pins.
Table 5 “Limiting values”
: Added “non-operating” to conditions column of T
stg
.
Table 5 “Limiting values”
: Updated
Table note 5 “The maximum non-operating
storage temperature is different than the temperature for required shelf life which
should be determined based on required shelf lifetime. Please refer to the JEDEC
spec (J-STD-033B.1) for further details.”
.
Table 5 “Limiting values”
: Updated storage temperature min/max to
65/+150.
Added
Table 7 “Thermal resistance value (C/W): ±15 %”
.
Added
Table 10 “Dynamic characteristic: internal oscillators”
.
Added
Table 11 “Dynamic characteristic: I/O pins
[1]
.
Table 8 “Static characteristics”
: Changed V
hys
typ value from 0.5V
DD(3V3)
to
0.05V
DD(3V3)
.
Table 13 “Dynamic characteristics of flash”
: Updated table.
Added
Section 9 “Thermal characteristics”
.
Added
Section 10.3 “Electrical pin characteristics”
.
Added
Section 14.2 “Crystal oscillator XTAL input and component selection”
.
Added
Section 14.3 “RTC 32 kHz oscillator component selection”
.
Added
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”
.
Added
Section 14.5 “Standard I/O pin configuration”
.
Added
Section 14.6 “Reset pin configuration”
.
Product data sheet
LPC2364_65_66_67_68 v.6
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