參數(shù)資料
型號: LPC2387FBD100
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: Single-chip 16-bit-32-bit MCU; 512 kB flash with ISP-IAP, Ethernet, USB 2.0 device-host-OTG, CAN, and 10-bit ADC-DAC
封裝: LPC2387FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,;
文件頁數(shù): 60/64頁
文件大?。?/td> 447K
代理商: LPC2387FBD100
LPC2387
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 10 February 2011
60 of 64
NXP Semiconductors
LPC2387
Single-chip 16-bit/32-bit MCU
17. Revision history
Table 18.
Document ID
LPC2387 v.4
Modifications:
Revision history
Release date
20110210
Table 3 “Pin description”
: Added
Table note 9
for XTAL1 and XTAL2 pins.
Table 3 “Pin description”
: Added
Table note 10
for RTCX1 and RTCX2 pins.
Table 4 “Limiting values”
: Changed V
ESD
min/max to
2500/+2500.
Table 6 “Static characteristics”
: Removed R
pu
.
Table 6 “Static characteristics”
,
Table note 14
: Changed value from 18 to 33.
Table 6 “Static characteristics”
: Updated min, typical and max values for oscillator pins.
Table 6 “Static characteristics”
: Updated conditions and typical values for I
DD(DCDC)pd(3V3)
,
I
BATact
; added I
DD(DCDC)dpd(3V3)
and I
BAT
.
Table 6 “Static characteristics”
: Changed I
2
C-bus V
hys
typical from 0.5V
DD
to 0.05V
DD
.
Section 2 “Features and benefits”
: Added deep power-down information.
Section 7.2 “On-chip flash programming memory”
“On-chip flash programming memory”:
Removed text regarding flash endurance minimum specs.
Section 7.23 “RTC and battery RAM”
: Added deep power-down information.
Section 7.24.2 “PLL”
: Changed input clock frequency max to 25 MHz.
Section 7.24.3 “Wake-up timer”
: Added deep power-down information.
Section 7.24.4 “Power control”
: Added deep power-down information.
Added
Section 7.24.4.4 “Deep power-down mode”
.
Section 7.25.2 “Brownout detection”
: Changed V
DD(3V3)
to V
DD(DCDC)(3V3)
.
Added
Section 9 “Thermal characteristics”
.
Added
Section 10.1 “Power-down mode”
.
Added
Section 10.2 “Deep power-down mode”
.
Added
Section 10.3 “Electrical pin characteristics”
.
Added
Section 11.1 “Internal oscillators”
.
Added
Section 11.2 “I/O pins”
.
Added
Section 11.4 “Flash memory”
.
Added
Section 13 “DAC electrical characteristics”
.
Added
Section 14.2 “Crystal oscillator XTAL input and component selection”
.
Added
Section 14.3 “RTC 32 kHz oscillator component selection”
.
Added
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”
.
Added
Section 14.5 “Standard I/O pin configuration”
.
Added
Section 14.6 “Reset pin configuration”
.
Moved
Figure 12 “External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)”
to
below
Table 7 “Dynamic characteristics”
.
20081029
Product data sheet
Added USB host/OTG features
Table 4: changed storage temperature range from
40
°
C/125
°
C to
65
°
C/150
°
C.
Table 6, V
hys
, moved 0.4 from Typ to Min column.
Table 6, V
I
, added Table note 8.
Table 6: updated Table note 10.
20080201
Product data sheet
20080114
Product data sheet
Data sheet status
Product data sheet
Change notice
-
Supersedes
LPC2387 v.3
LPC2387 v.3
Modifications:
-
LPC2387 v.2
LPC2387 v.2
LPC2387 v.1
-
-
LPC2387 v.1
-
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