參數(shù)資料
型號(hào): M24256-BFMB6TG/K
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
封裝: 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8
文件頁數(shù): 28/42頁
文件大?。?/td> 501K
代理商: M24256-BFMB6TG/K
Package mechanical data
M24256-BF, M24256-BR, M24256-BW, M24256-DR
Doc ID 6757 Rev 21
Figure 17.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1.
Drawing is not to scale.
2.
The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3.
The circle in the top view of the package indicates the position of pin 1.
Table 21.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.55
0.45
0.6
0.0217
0.0177
0.0236
A1
0.02
0
0.05
0.0008
0
0.002
b
0.25
0.2
0.3
0.0098
0.0079
0.0118
D
2
1.9
2.1
0.0787
0.0748
0.0827
D2
1.6
1.5
1.7
0.063
0.0591
0.0669
E
3
2.9
3.1
0.1181
0.1142
0.122
E2
0.2
0.1
0.3
0.0079
0.0039
0.0118
e
0.5
-
0.0197
-
L
0.45
0.4
0.5
0.0177
0.0157
0.0197
L1
0.15
0.0059
L3
0.3
0.0118
ddd(2)
2.
Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.08
D
E
UFDFPN-01
A
A1
ddd
L1
e
b
D2
L
E2
L3
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