參數(shù)資料
型號(hào): M24256-BFMB6TG/K
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
封裝: 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8
文件頁(yè)數(shù): 32/42頁(yè)
文件大?。?/td> 501K
代理商: M24256-BFMB6TG/K
Revision history
M24256-BF, M24256-BR, M24256-BW, M24256-DR
Doc ID 6757 Rev 21
9
Revision history
Table 26.
Document revision history
Date
Revision
Changes
29-Jan-2001
1.1
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
LGA8 and SO8(wide) packages added
References to PSDIP8 changed to PDIP8, and Package Mechanical data
updated
10-Apr-2001
1.2
LGA8 Package Mechanical data and illustration updated
SO16 package removed
16-Jul-2001
1.3
LGA8 Package given the designator “LA”
02-Oct-2001
1.4
LGA8 Package mechanical data updated
13-Dec-2001
1.5
Document becomes Preliminary Data
Test conditions for ILI, ILO, ZL and ZH made more precise
VIL and VIH values unified. tNS value changed
12-Jun-2001
1.6
Document promoted to Full Datasheet
22-Oct-2003
2.0
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Write
Operations, Read Operations. VIL(min) improved to –0.45V.
02-Sep-2004
3.0
LGA8 package is Not for New Design. 5V and -S supply ranges, and
Device Grade 5 removed. Absolute Maximum Ratings for VIO(min) and
VCC(min) changed. Soldering temperature information clarified for RoHS
compliant devices. Device grade information clarified. AEC-Q100-002
compliance. VIL specification unified for SDA, SCL and WC
22-Feb-2005
4.0
Initial delivery state is FFh (not necessarily the same as Erased).
LGA package removed, TSSOP8 and SO8N packages added (see
Voltage range R (1.8V to 5.5V) also offered. Minor wording changes.
ZL Test Conditions modified in Table 12: Input parameters and Note 2
added.
ICC and ICC1 values for VCC = 5.5V added to Table 13: DC characteristics
Power On Reset paragraph specified.
tW max value modified in Table 16: 400 kHz AC characteristics and note 4
added. Plating technology changed in Table 23: Ordering information
Resistance and capacitance renamed in Figure 6.
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